EDB4064B3PB-8D-F-D
- Mfr.Part #
- EDB4064B3PB-8D-F-D
- Manufacturer
- Micron Technology
- Package / Case
- 216-WFBGA
- Datasheet
- Download
- Description
- IC DRAM 4GBIT PARALLEL 216WFBGA
- Stock
- 23,485
- In Stock :
- 23,485
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Operating Temperature :
- -30°C~85°C TC
- Memory Type :
- Volatile
- Max Frequency :
- 400MHz
- RoHS Status :
- ROHS3 Compliant
- Packaging :
- Tray
- Frequency :
- 400MHz
- Supplier Device Package :
- 216-WFBGA (12x12)
- Memory Size :
- 4Gb 64M x 64
- Min Operating Temperature :
- -30°C
- Voltage - Supply :
- 1.14V~1.95V
- Memory Format :
- DRAM
- Package / Case :
- 216-WFBGA
- Max Operating Temperature :
- 85°C
- Clock Frequency :
- 400MHz
- Address Bus Width :
- 14b
- Mounting Type :
- Surface Mount
- Interface :
- Parallel
- Memory Interface :
- Parallel
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Density :
- 4 GB
- Number of Pins :
- 216
- Published :
- 2015
- Datasheets
- EDB4064B3PB-8D-F-D

Memory Micron Technology EDB4064B3PB-8D-F-D Overview
The Memory Micron Technology EDB4064B3PB-8D-F-D represents a state-of-the-art DRAM module designed to meet the demanding requirements of modern high-performance computing systems. Manufactured by Micron Technology, this IC DRAM component offers a substantial 4 Gbit capacity, encapsulated in a compact 216WFBGA package. This product is engineered to deliver high-speed data transmission and low-power operation, making it an ideal choice for applications requiring massive data handling capabilities and efficient power management. The integration of advanced technology in the EDB4064B3PB-8D-F-D ensures that it can support the rigorous needs of both existing and emerging memory applications, setting a new standard in DRAM performance.
EDB4064B3PB-8D-F-D Features
This IC DRAM features a 4 Gbit parallel interface, offering high data transfer rates that are essential for throughput-intensive applications. Its 216-pin WFBGA (fine-pitch ball grid array) packaging not only allows for a more compact design but also enhances the thermal and electrical performance of the device. With robust support for extended temperature ranges, the EDB4064B3PB-8D-F-D is built to withstand diverse operating conditions, ensuring reliability and stability across various user scenarios.
EDB4064B3PB-8D-F-D Applications
- Smartphones and Tablets: Utilizes its high-speed data processing capabilities to manage multiple applications simultaneously, enhancing the multitasking experience.
- Embedded Systems: Employs its robust thermal and electrical properties to perform reliably in harsh environmental conditions, suitable for automotive and industrial applications.
- Personal Computers: Supports complex computations and graphics processing, providing the necessary speed and efficiency for high-end computing tasks.
- Data Centers: Takes advantage of its large capacity and speed to handle vast amounts of data, crucial for server applications and network infrastructure.
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