DF62W-9P-2.2DSA(01)
- Mfr.Part #
- DF62W-9P-2.2DSA(01)
- Manufacturer
- Hirose
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 9POS 2.2MM
- Stock
- 36,733
- In Stock :
- 36,733
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- Manufacturer :
- Hirose
- Product Category :
- Headers, Male Pins
- Pitch - Mating :
- 0.087 2.20mm
- Fastening Type :
- Latch Holder
- Contact Length - Post :
- 0.112 2.84mm
- Contact Finish - Mating :
- Gold
- Shrouding :
- Shrouded - 4 Wall
- Connector Type :
- Header
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Insulation Height :
- 0.610 15.49mm
- Style :
- Board to Cable/Wire
- Material Flammability Rating :
- UL94 V-0
- Termination :
- Solder
- Row Spacing - Mating :
- 0.087 (2.20mm)
- Packaging :
- Bulk
- Contact Shape :
- Square
- Insulation Color :
- Black
- Number of Positions :
- 9
- Number of Rows :
- 3
- Ingress Protection :
- IP67
- Contact Material :
- Phosphor Bronze
- Insulation Material :
- Polybutylene Terephthalate (PBT)
- Number of Positions Loaded :
- All
- Series :
- DF62W
- Feature :
- Board Guide
- Contact Type :
- Male Pin
- Current Rating (Amps) :
- Varies by WireGAuge
- Operating Temperature :
- -35°C~105°C
- Mounting Type :
- Through Hole
- Voltage - Rated :
- 250V
- Datasheets
- DF62W-9P-2.2DSA(01)
DF62W Series 3-Row Header Solder Phosphor Bronze Bulk Through Hole Gold Polybutylene Terephthalate (PBT) 9-Position Board to Cable/Wire 0.610 15.49mm Height
DF62W-9P-2.2DSA(01) Overview
The product comes in a package of Header.Through Hole is the type of mounting for the device.To package the product, a Bulk case is used.The product is a member of the DF62W Series.It is more powerful in many ways due to its Board Guide feature.It operates at an operating temperature of -35°C~105°C.
DF62W-9P-2.2DSA(01) Features
DF62W series
DF62W-9P-2.2DSA(01) Applications
There are a lot of Hirose Electric Co Ltd
DF62W-9P-2.2DSA(01) Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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