DF3E-3P-2V(24)
- Mfr.Part #
- DF3E-3P-2V(24)
- Manufacturer
- Hirose
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 3POS 2MM
- Stock
- 1,978
- In Stock :
- 1,978
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- Manufacturer :
- Hirose
- Product Category :
- Headers, Male Pins
- Shrouding :
- Shrouded - 4 Wall
- Material Flammability Rating :
- UL94 V-0
- Contact Finish - Mating :
- Tin
- Contact Type :
- Male Pin
- Fastening Type :
- Push-Pull
- Number of Rows :
- 1
- Style :
- Board to Board or Cable
- Insulation Material :
- Polyamide (PA), Nylon
- Voltage - Rated :
- 250VAC
- Insulation Color :
- Black
- Feature :
- Board Guide, Solder Retention
- Packaging :
- Tube
- Factory Lead Time :
- 10 Weeks
- Mounting Type :
- Surface Mount
- Contact Finish Thickness - Post :
- 39.4μin 1.00μm
- Number of Positions Loaded :
- All
- RoHS Status :
- RoHS Compliant
- Insulation Height :
- 0.232 5.90mm
- Contact Shape :
- Circular
- Contact Material :
- Brass
- Operating Temperature :
- -55°C~105°C
- Current Rating (Amps) :
- Varies by WireGAuge
- Contact Finish Thickness - Mating :
- 39.4μin 1.00μm
- Termination :
- Solder
- Stack Height (Mating) :
- 8.4mm
- Connector Type :
- Header
- Number of Positions :
- 3
- Series :
- DF3
- Pitch - Mating :
- 0.079 2.00mm
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Datasheets
- DF3E-3P-2V(24)
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DF3 Series 1-Row Header Solder Brass Tube Surface Mount Tin Polyamide (PA), Nylon 3-Position Board to Board or Cable 0.232 5.90mm Height
DF3E-3P-2V(24) Overview
This product is packaged in a Header cartonThis device's mounting type is Surface Mount.It's packaged in a Tube case.DF3 Series product.Its Board Guide, Solder Retention feature makes it more powerful in a number of ways.Running in -55°C~105°C Operating Temperature.
DF3E-3P-2V(24) Features
DF3 series
DF3E-3P-2V(24) Applications
There are a lot of Hirose Electric Co Ltd
DF3E-3P-2V(24) Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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