DF1EG-9P-2.5DSA
- Mfr.Part #
- DF1EG-9P-2.5DSA
- Manufacturer
- Hirose
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 9POS 2.5MM
- Stock
- 46,989
- In Stock :
- 46,989
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- Manufacturer :
- Hirose
- Product Category :
- Headers, Male Pins
- Series :
- DF1E
- Number of Rows :
- 1
- Material Flammability Rating :
- UL94 V-0
- Number of Positions :
- 9
- Operating Temperature :
- -35°C~85°C
- Style :
- Board to Cable/Wire
- Termination :
- Solder
- Contact Shape :
- Square
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Contact Material :
- Brass
- Contact Finish Thickness - Mating :
- 39.4μin 1.00μm
- Connector Type :
- Header
- Reach Compliance Code :
- Unknown
- Stack Height (Mating) :
- 14.3mm 15.8mm 19.8mm
- Pitch - Mating :
- 0.098 2.50mm
- Contact Finish - Mating :
- Tin
- Contact Length - Mating :
- 0.177 4.50mm
- Contact Type :
- Male Pin
- Insulation Material :
- Polyamide (PA), Nylon
- Number of Positions Loaded :
- All
- Mounting Type :
- Through Hole
- Shrouding :
- Shrouded - 4 Wall
- Contact Length - Post :
- 0.118 3.00mm
- Insulation Color :
- Natural
- RoHS Status :
- RoHS Compliant
- Fastening Type :
- Latch Holder
- Current Rating (Amps) :
- 3A
- Insulation Height :
- 0.642 16.30mm
- Mount :
- Through Hole
- Factory Lead Time :
- 10 Weeks
- Packaging :
- Bulk
- Pbfree Code :
- yes
- Datasheets
- DF1EG-9P-2.5DSA

DF1E Series 1-Row Header Solder Brass Bulk Through Hole Tin Polyamide (PA), Nylon 9-Position Board to Cable/Wire 0.642 16.30mm Height
DF1EG-9P-2.5DSA(35) Overview
Currently, it is packaged in Header.The mounting type of the device is Through Hole.A Bulk case is used to package the product.A product of the DF1E Series, it belongs to the range of products of that series.Through Hole represents the mounting point for the part.-35°C~85°C Operating Temperature is the default operating temperature for the device.
DF1EG-9P-2.5DSA(35) Features
DF1E series
DF1EG-9P-2.5DSA(35) Applications
There are a lot of Hirose Electric Co Ltd
DF1EG-9P-2.5DSA(35) Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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