DF1C-2P-2.5DSA(05)
- Mfr.Part #
- DF1C-2P-2.5DSA(05)
- Manufacturer
- Hirose
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 2POS 2.5MM
- Stock
- 44,955
- In Stock :
- 44,955
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- Manufacturer :
- Hirose
- Product Category :
- Headers, Male Pins
- RoHS Status :
- RoHS Compliant
- Mounting Type :
- Through Hole
- Style :
- Board to Cable/Wire
- Feature :
- Keying Slot
- Pitch - Mating :
- 0.098 2.50mm
- Contact Shape :
- Square
- Insulation Material :
- Polyamide (PA), Nylon
- Number of Pins :
- 2
- Fastening Type :
- Push-Pull
- Contact Finish - Mating :
- Tin
- Contact Finish - Post :
- Tin
- Contact Plating :
- Tin
- Packaging :
- Bulk
- Stack Height (Mating) :
- 14mm
- Series :
- DF1B
- Connector Type :
- Header
- Contact Material :
- Brass
- Operating Temperature :
- -35°C~85°C
- Shrouding :
- Shrouded - 4 Wall
- Termination :
- Solder
- Voltage - Rated :
- 250V
- Mount :
- Through Hole
- Number of Positions :
- 2
- Pitch :
- 2.4892mm
- Number of Rows :
- 1
- Contact Length - Mating :
- 0.177 4.50mm
- Contact Type :
- Male Pin
- Number of Positions Loaded :
- All
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Material Flammability Rating :
- UL94 V-0
- Datasheets
- DF1C-2P-2.5DSA(05)
DF1B Series 1-Row Header Solder Brass Bulk Through Hole Tin Polyamide (PA), Nylon 2-Position Board to Cable/Wire
DF1C-2P-2.5DSA(05) Overview
The product comes in a package of Header.Through Hole is the type of mounting for the device.To package the product, a Bulk case is used.The product is a member of the DF1B Series.2 pins are present on the device.It is more powerful in many ways due to its Keying Slot feature.It is mounted by Through Hole.It operates at an operating temperature of -35°C~85°C.
DF1C-2P-2.5DSA(05) Features
DF1B series
DF1C-2P-2.5DSA(05) Applications
There are a lot of Hirose Electric Co Ltd
DF1C-2P-2.5DSA(05) Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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