CYP15G0403DXB-BGI

Manufacturer :

Infineon Technologies

Product Category :

Telecom

Series :

HOTlink II™

Package / Case :

256-LBGA Exposed Pad

Function :

Transceiver

Mount :

Surface Mount

Operating Supply Voltage :

3.3V

Time@Peak Reflow Temperature-Max (s) :

30

RoHS Status :

Non-RoHS Compliant

Data Rate :

1500000 Mbps

Width :

27mm

Mounting Type :

Surface Mount

Peak Reflow Temperature (Cel) :

225

Voltage - Supply :

3.135V~3.465V

Length :

27mm

Number of Circuits :

4

Reach Compliance Code :

not_compliant

Terminal Pitch :

1.27mm

JESD-609 Code :

e0

Packaging :

Tray

Interface :

LVTTL

Terminal Finish :

Tin/Lead (Sn/Pb)

Terminal Position :

BOTTOM

Base Part Number :

CY*15G04

Supply Voltage :

3.3V

Operating Temperature :

-40°C~85°C

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Number of Transceivers :

4

Published :

2003

Number of Terminations :

256

Terminal Form :

Ball

Qualification Status :

Not Qualified

Number of Pins :

256

Current - Supply :

900mA

Nominal Supply Current :

1.32A