CYP15G0401RB-BGC

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Mfr.Part #
CYP15G0401RB-BGC
Manufacturer
Infineon Technologies
Package / Case
256-LBGA Exposed Pad
Datasheet
Download
Description
IC TELECOM INTERFACE 256BGA
Stock
43,297
In Stock :
43,297

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Manufacturer :
Infineon Technologies
Product Category :
Telecom
Current - Supply :
640mA
Reach Compliance Code :
Unknown
Voltage - Supply :
3.135V~3.465V
Length :
27mm
Qualification Status :
COMMERCIAL
Terminal Pitch :
1.27mm
Operating Temperature :
0°C~70°C
Mounting Type :
Surface Mount
Terminal Finish :
TIN LEAD
Interface :
LVTTL
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Pbfree Code :
No
JESD-30 Code :
S-PBGA-B256
RoHS Status :
Non-RoHS Compliant
Terminal Form :
Ball
Supply Voltage :
3.3V
Terminal Position :
BOTTOM
Function :
Receiver
Number of Terminations :
256
Surface Mount :
yes
Number of Circuits :
4
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
HOTlink II™
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Packaging :
Tray
Width :
27mm
Telecom IC Type :
TELECOM CIRCUIT
Package / Case :
256-LBGA Exposed Pad
JESD-609 Code :
e0
Datasheets
CYP15G0401RB-BGC
Introducing Telecom Infineon Technologies CYP15G0401RB-BGC from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C, Mounting Type:Surface Mount, Number of Terminations:256, Package / Case:256-LBGA Exposed Pad, CYP15G0401RB-BGC pinout, CYP15G0401RB-BGC datasheet PDF, CYP15G0401RB-BGC amp .Beyond Telecom Infineon Technologies CYP15G0401RB-BGC ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYP15G0401RB-BGC


Telecom Infineon Technologies CYP15G0401RB-BGC Overview

The Telecom Infineon Technologies CYP15G0401RB-BGC is a high-performance IC telecom interface, designed by Infineon Technologies, optimized for advanced telecommunications infrastructure systems. This integrated circuit is housed in a compact 256-ball grid array package (BGA), making it ideal for high-density mounting necessary in modern telecom equipment. With its robust design and cutting-edge technology, this IC delivers reliable performance under the demanding conditions typical in telecom applications, ensuring seamless data transmission and interface connectivity. Its capabilities make it a pivotal component for developers aiming to build or upgrade their telecom systems, catering effectively to the needs of B2B customers seeking bulk purchasing options for sophisticated, high-reliability components.

CYP15G0401RB-BGC Features

This IC telecom interface is equipped with a multitude of features designed to enhance its performance and suitability in telecom applications. It supports high-speed data transmission, offers excellent thermal management properties, and provides robust ESD protection, ensuring the reliability and longevity of the device in various operational conditions. The compact 256BGA packaging not only allows for efficient use of board space but also facilitates better electrical performance, making it a versatile choice for integrating into complex telecommunications systems.

CYP15G0401RB-BGC Applications

  • Telecommunications Networking Equipment: Utilized in routers, switches, and base station hardware to manage data flow efficiently and reliably across network infrastructures.
  • High-Speed Internet Infrastructure: Key component in the hardware that facilitates broadband and fiber-optic communications, enhancing connectivity and network stability.
  • Wireless Communication Systems: Plays a critical role in the development and enhancement of wireless communication towers and related infrastructure, ensuring high data throughput and improved signal integrity.
  • Satellite Communications: Integral to the equipment used in satellite communications, where it supports complex signal processing tasks required for long-distance data transmission.
  • Telecom Switching Systems: Vital for the operation of modern digital switching systems, enabling rapid, reliable switching necessary for today's communication demands.
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