CYP15G0401DXB-BGI
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- Mfr.Part #
- CYP15G0401DXB-BGI
- Manufacturer
- Infineon Technologies
- Package / Case
- 256-LBGA Exposed Pad
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE 256BGA
- Stock
- 30,068
- In Stock ：
- 30,068
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Telecom
- RoHS Status :
- Non-RoHS Compliant
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Form :
- Ball
- Terminal Position :
- BOTTOM
- Packaging :
- Tray
- Function :
- Transceiver
- Base Part Number :
- CY*15G04
- Mount :
- Surface Mount
- Terminal Pitch :
- 1.27mm
- Qualification Status :
- Not Qualified
- Width :
- 27mm
- Operating Temperature :
- -40°C~85°C
- Data Rate :
- 1500000 Mbps
- Number of Transceivers :
- 4
- Number of Circuits :
- 4
- Package / Case :
- 256-LBGA Exposed Pad
- Voltage - Supply :
- 3.135V~3.465V
- Supply Voltage :
- 3.3V
- Number of Terminations :
- 256
- Operating Supply Voltage :
- 3.3V
- Length :
- 27mm
- Published :
- 2005
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mounting Type :
- Surface Mount
- Current - Supply :
- 830mA
- Nominal Supply Current :
- 1.1A
- Series :
- HOTlink II™
- Number of Pins :
- 256
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Interface :
- LVTTL
- Peak Reflow Temperature (Cel) :
- 235
- JESD-609 Code :
- e0
- Datasheets
- CYP15G0401DXB-BGI
Telecom Infineon Technologies CYP15G0401DXB-BGI Overview
The Telecom Infineon Technologies CYP15G0401DXB-BGI is an advanced telecom interface IC designed to meet the rigorous demands of modern communication infrastructures. Manufactured by Infineon Technologies, this high-performance chip is encapsulated in a compact 256-BGA package, ensuring robust performance in a variety of telecommunications applications. The device facilitates efficient data transmission and reception, featuring high integration to reduce system complexity and enhance reliability. Its versatility makes it an ideal choice for manufacturers looking to implement a powerful telecom interface solution that is both durable and cost-effective.
CYP15G0401DXB-BGI Features
This IC offers a range of features that make it a standout choice for telecommunications equipment. It supports high-speed signal processing capabilities, essential for handling large volumes of data with minimal latency. The chip is also equipped with multiple interface options, allowing for seamless integration into existing infrastructure. Enhanced thermal management techniques ensure the device operates reliably under various environmental conditions, contributing to its longevity and sustained performance.
CYP15G0401DXB-BGI Applications
- Data Centers: In data centers, the CYP15G0401DXB-BGI can manage high-speed data transfers between servers and communication systems, ensuring reliable and efficient data handling.
- Telecommunication Equipment: Utilized in routers and switches, this IC enhances the capability to handle high-bandwidth internet traffic, crucial for modern telecommunication networks.
- Wireless Base Stations: The chip's robust design is ideal for deployment in wireless base stations, where it helps in processing signals and data transmission with enhanced efficiency and reliability.
- Network Interface Cards: Used in network interface cards, it facilitates faster communication interfaces between computers and networks, boosting overall system performance and connectivity.
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