BUK7Y2R0-40HX

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Mfr.Part #
BUK7Y2R0-40HX
Manufacturer
Nexperia
Package / Case
SC-100, SOT-669
Datasheet
Download
Description
MOSFET N-CH 40V 120A LFPAK56
Stock
4,477
In Stock :
4,477

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Manufacturer :
Nexperia
Product Category :
Transistors - FETs, MOSFETs - Single
Gate Charge (Qg) (Max) @ Vgs :
90.5nC @ 10V
Rds On (Max) @ Id, Vgs :
2m Ω @ 25A, 10V
Drain to Source Voltage (Vdss) :
40V
Vgs(th) (Max) @ Id :
3.6V @ 1mA
Vgs (Max) :
+20V, -10V
Operating Temperature :
-55°C~175°C TJ
Input Capacitance (Ciss) (Max) @ Vds :
5450pF @ 25V
Package / Case :
SC-100, SOT-669
Reach Compliance Code :
Compliant
Drive Voltage (Max Rds On,Min Rds On) :
10V
Power Dissipation-Max :
217W Ta
Packaging :
Tape and Reel (TR)
Factory Lead Time :
12 Weeks
Mounting Type :
Surface Mount
Series :
Automotive, AEC-Q101
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
FET Type :
N-Channel
Current - Continuous Drain (Id) @ 25°C :
120A Ta
Pin Count :
4
Datasheets
BUK7Y2R0-40HX
Introducing Transistors - FETs, MOSFETs - Single Nexperia BUK7Y2R0-40HX from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-55°C~175°C TJ, Package / Case:SC-100, SOT-669, Mounting Type:Surface Mount, BUK7Y2R0-40HX pinout, BUK7Y2R0-40HX datasheet PDF, BUK7Y2R0-40HX amp .Beyond Transistors - FETs, MOSFETs - Single Nexperia BUK7Y2R0-40HX ,we also offer EPC2019, EPC2053, EPC2015C, Our vast inventory has you covered. Contact us now for immediate solutions.

Nexperia BUK7Y2R0-40HX


N-Channel Tape & Reel (TR) 2m Ω @ 25A, 10V +20V, -10V 5450pF @ 25V 90.5nC @ 10V 40V SC-100, SOT-669

BUK7Y2R0-40HX Description


N-channel MOSFET with automotive certification employing the most recent Trench 9 low ohmic superjunction technology, packed in a durable LFPAK56 packaging. This product offers great performance and endurance and has been thoroughly designed and certified to fulfill AEC-Q101 criteria.



BUK7Y2R0-40HX Features


Fully automotive qualified to AEC-Q101:

• 175 °C rating suitable for thermally demanding environments

• Trench 9 Superjunction technology:

• Reduced cell pitch enables enhanced power density and efficiency with lower RDSon in

same footprint

• Improved SOA and avalanche capability compared to standard TrenchMOS

• Tight VGS(th) limits enable easy paralleling of MOSFETs

• LFPAK Gull Wing leads:

• High Board Level Reliability absorbing mechanical stress during thermal cycling, unlike

traditional QFN packages

• Visual (AOI) soldering inspection, no need for expensive x-ray equipment

• Easy solder wetting for good mechanical solder joint

• LFPAK copper clip technology:

• Improved reliability, with reduced Rth and RDSon

• Increases maximum current capability and improved current spreading



BUK7Y2R0-40HX Applications


12 V automotive systems

Motors, lamps and solenoid control

Start-Stop micro-hybrid applications

Transmission control

Ultra high performance power switching


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