A2F200M3F-FG256
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- Mfr.Part #
- A2F200M3F-FG256
- Manufacturer
- Microchip Technology
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 80MHZ 256FBGA
- Stock
- 15,651
- In Stock ：
- 15,651
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Published :
- 2012
- Terminal Form :
- Ball
- Terminal Position :
- BOTTOM
- Height Seated (Max) :
- 1.7mm
- Supply Voltage :
- 1.5V
- Number of Pins :
- 256
- Interface :
- EBI/EMI, Ethernet, I2C, SPI, UART, USART
- Max Supply Voltage :
- 1.575V
- Number of I/O :
- MCU - 25, FPGA - 66
- Length :
- 17mm
- Packaging :
- Tray
- RoHS Status :
- Non-RoHS Compliant
- Number of Logic Blocks (LABs) :
- 8
- Factory Lead Time :
- 12 Weeks
- Operating Supply Current :
- 2mA
- Series :
- SmartFusion®
- Operating Temperature :
- 0°C~85°C TJ
- Number of Outputs :
- 66
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Peripherals :
- DMA, POR, WDT
- Package / Case :
- 256-LBGA
- Terminal Finish :
- TIN LEAD/TIN LEAD SILVER
- Number of Gates :
- 200000
- Min Supply Voltage :
- 1.425V
- Number of Terminations :
- 256
- Base Part Number :
- A2F200
- Operating Supply Voltage :
- 1.5V
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Flash Size :
- 256KB
- Core Architecture :
- ARM
- Architecture :
- MCU, FPGA
- Time@Peak Reflow Temperature-Max (s) :
- 30
- RAM Size :
- 64KB
- Frequency :
- 80MHz
- Mount :
- Surface Mount
- Peak Reflow Temperature (Cel) :
- 225
- Width :
- 17mm
- Core Processor :
- ARM® Cortex®-M3
- Primary Attributes :
- ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
- Terminal Pitch :
- 1mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Qualification Status :
- Not Qualified
- Datasheets
- A2F200M3F-FG256
256 Terminations 0°C~85°C TJ 256 Pin A2F200 System On Chip SmartFusion® Series MCU - 25, FPGA - 66 I/O 1.5V Min 1.425V V Max 1.575V V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 256-LBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion® is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.A significant feature of this SoC security is the combination of ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of MCU - 25, FPGA - 66 inputs and outputs.Ideally, a power supply with a voltage of 1.5V should be used.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 256 terminations.This SoC chip is capable of having 66 outputs, which is convenient.This flash has a size of 256KB.It is possible to find system on chips that are similar in specs and purpose by searching for A2F200.During operation, the wireless SoC runs at a frequency of 80MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC has a pin count of 256.Voltages up to 1.575V are specified for this SoC security.Power is provided to it at least to the extent that 1.425V is required.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-FG256 System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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