A2F200M3F-1FG256
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- Mfr.Part #
- A2F200M3F-1FG256
- Manufacturer
- Microchip Technology
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 100MHZ 256FBGA
- Stock
- 21,984
- In Stock ：
- 21,984
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Number of Pins :
- 256
- RoHS Status :
- Non-RoHS Compliant
- Package / Case :
- 256-LBGA
- Operating Temperature :
- -40°C~100°C TJ
- Supply Voltage-Max (Vsup) :
- 1.575V
- Factory Lead Time :
- 12 Weeks
- Peak Reflow Temperature (Cel) :
- 225
- Supply Voltage :
- 1.5V
- Peripherals :
- DMA, POR, WDT
- Flash Size :
- 256KB
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Packaging :
- Tray
- Primary Attributes :
- ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
- Supply Voltage-Min (Vsup) :
- 1.425V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Pitch :
- 1mm
- Number of Gates :
- 200000
- Operating Supply Current :
- 3mA
- Number of I/O :
- MCU - 25, FPGA - 66
- Core Architecture :
- ARM
- JESD-609 Code :
- e0
- Architecture :
- MCU, FPGA
- Published :
- 2009
- Interface :
- EBI/EMI, Ethernet, I2C, SPI, UART, USART
- Number of Terminations :
- 256
- Terminal Form :
- Ball
- Base Part Number :
- A2F200
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Height Seated (Max) :
- 1.7mm
- Frequency :
- 100MHz
- Core Processor :
- ARM® Cortex®-M3
- RAM Size :
- 64KB
- Radiation Hardening :
- No
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Surface Mount :
- yes
- Number of Logic Blocks (LABs) :
- 8
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Length :
- 17mm
- Number of Outputs :
- 66
- Terminal Position :
- BOTTOM
- Width :
- 17mm
- Series :
- SmartFusion®
- Datasheets
- A2F200M3F-1FG256
256 Terminations -40°C~100°C TJ 256 Pin A2F200 System On Chip SmartFusion® Series MCU - 25, FPGA - 66 I/O 1.5V
This SoC is built on ARM® Cortex®-M3 core processor(s).
ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 256-LBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion® series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has MCU - 25, FPGA - 66 I/Os.Use a power supply with a voltage of 1.5V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.575V.Power supplies of at least 1.425V are required.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A system on a chip benefits from having 256 terminations.A SoC chip like this can have 66 outputs.A flashing 256KB appears on it.Searching A2F200 will bring up system on chips with similar specs and purposes.At 100MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 256-pin version.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-1FG256I System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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