71T75602S133BGG

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Mfr.Part #
71T75602S133BGG
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
119-BGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 119PBGA
Stock
7,096
In Stock :
7,096

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Base Part Number :
IDT71T75
Memory Size :
18Mb 512K x 36
Operating Temperature :
0°C~70°C TA
Clock Frequency :
133MHz
Voltage - Supply :
2.375V~2.625V
Memory Interface :
Parallel
Supplier Device Package :
119-PBGA (14x22)
Mounting Type :
Surface Mount
Access Time :
4.2ns
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Type :
Volatile
Factory Lead Time :
10 Weeks
Memory Format :
SRAM
RoHS Status :
ROHS3 Compliant
Package / Case :
119-BGA
Packaging :
Tray
Datasheets
71T75602S133BGG
Introducing Memory Intersil (Renesas Electronics Corporation) 71T75602S133BGG from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:IDT71T75, Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, Package / Case:119-BGA, 71T75602S133BGG pinout, 71T75602S133BGG datasheet PDF, 71T75602S133BGG amp .Beyond Memory Intersil (Renesas Electronics Corporation) 71T75602S133BGG ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 71T75602S133BGG


Memory Intersil (Renesas Electronics Corporation) 71T75602S133BGG Overview

The Memory Intersil (Renesas Electronics Corporation) 71T75602S133BGG SRAM offers a high-capacity storage solution of 18Mbit, packaged in a compact 119-pin PBGA (Plastic Ball Grid Array). Designed to provide rapid access and high speeds, this IC (Integrated Circuit) is ideal for applications requiring quick data retrieval and storage. The robust design ensures reliability and performance, making it an excellent choice for advanced industrial and technology applications where space and speed are at a premium.

71T75602S133BGG Features

This IC features a parallel interface, offering high-speed data transfer and accessibility. With its large 18MBIT capacity, the SRAM is suitable for complex processing tasks. The 119PBGA package is designed for efficient space usage and can be integrated into a variety of electronic assemblies. Additionally, its durability and operational stability under a wide range of environmental conditions make it highly versatile.

71T75602S133BGG Applications

  • Advanced Computing Systems: Enhances performance in servers and high-end computing devices by providing rapid access to large amounts of data, enabling faster processing and improved system efficiency.
  • Networking Equipment: Used in routers and switches for packet buffering, ensuring efficient data flow and management in communication networks.
  • Telecommunication Infrastructure: Supports high-speed telecom operations by offering reliable and quick data storage, critical for real-time communication processing.
  • Aerospace and Defense: Meets the rigorous data bandwidth and storage requirements in military and aerospace applications, providing dependable, quick-access memory under extreme conditions.
  • Automotive Electronics: Integral in advanced driver-assistance systems (ADAS) for processing and storing sensor data, enhancing vehicle response times and safety features.
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Shipping Cost

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