5AGTFD3H3F35I3N

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Mfr.Part #
5AGTFD3H3F35I3N
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA Exposed Pad
Datasheet
Download
Description
IC FPGA 544 I/O 1152FBGA
Stock
45,086
In Stock :
45,086

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Supply Voltage :
1.15V
Voltage - Supply :
1.12V~1.18V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Operating Temperature :
-40°C~100°C TJ
Terminal Pitch :
1mm
RoHS Status :
RoHS Compliant
Terminal Form :
Ball
Base Part Number :
5AGTFD3
JESD-30 Code :
S-PBGA-B1152
Total RAM Bits :
19822592
Qualification Status :
Not Qualified
Package / Case :
1152-BBGA, FCBGA Exposed Pad
Number of I/O :
544
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
Arria V GT
Height Seated (Max) :
2.7mm
Packaging :
Tray
Mounting Type :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Code :
e1
ECCN Code :
3A001.A.7.A
Terminal Position :
BOTTOM
Number of Logic Elements/Cells :
362000
Width :
35mm
Power Supplies :
1.151.2/3.32.5V
Length :
35mm
Surface Mount :
yes
Number of Outputs :
544
HTS Code :
8542.39.00.01
Number of LABs/CLBs :
17110
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Clock Frequency :
670MHz
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Number of Inputs :
544
Datasheets
5AGTFD3H3F35I3N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5AGTFD3H3F35I3N from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Base Part Number:5AGTFD3, Package / Case:1152-BBGA, FCBGA Exposed Pad, Mounting Type:Surface Mount, 5AGTFD3H3F35I3N pinout, 5AGTFD3H3F35I3N datasheet PDF, 5AGTFD3H3F35I3N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5AGTFD3H3F35I3N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5AGTFD3H3F35I3N


array of logic functions and system-level integration, the 5AGTFD3H3F35I3N is ideally suited for applications requiring high I/O bandwidth and extensive logic capacity. With a robust 1152FBGA package and 544 user I/Os, it provides substantial scalability and connectivity options, ensuring it can adapt to the most challenging and diverse technological environments.

5AGTFD3H3F35I3N Features

This FPGA model boasts several key features that make it a prime choice for designers and engineers. These features include a dense logic capacity, facilitating complex digital computations and processing tasks at high speeds. The device also supports a variety of memory interfaces, enhancing data throughput and system efficiency. With its powerful signal processing capabilities and support for multi-gigabit transceivers, the 5AGTFD3H3F35I3N can handle a wide range of high-speed data applications, from advanced communication systems to sophisticated embedded solutions.

5AGTFD3H3F35I3N Applications

  • Telecommunications Infrastructure: In telecom, this FPGA can be used to manage signal processing tasks, support multiple communication standards, and handle high-speed data transfers, ensuring reliable and flexible network operations.
  • Automotive Driver Assistance Systems (ADAS): The 5AGTFD3H3F35I3N can process complex algorithms required for real-time sensor data processing in ADAS, contributing to safer driving technologies.
  • Data Center Applications: Ideal for use in data centers, this FPGA enhances data processing capabilities and supports cloud computing infrastructures with improved data bandwidth and lower latency.
  • Industrial Automation: In industrial settings, the FPGA can control machinery and automate processes, increasing efficiency and precision in production lines.
  • Medical Imaging: This product is also pivotal in medical imaging equipment, where it processes high volumes of data, ensuring quick and accurate imaging results crucial for diagnostics.
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