XUF216-256-FB236-C20

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Mfr.Part #
XUF216-256-FB236-C20
Manufacturer
XMOS
Package / Case
236-LFBGA
Datasheet
Download
Description
IC MCU 32BIT 2MB FLASH 236FBGA
Stock
23,802
In Stock :
23,802

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Manufacturer :
XMOS
Product Category :
Microcontrollers
Package / Case :
236-LFBGA
Connectivity :
USB
Operating Temperature :
0°C~70°C TA
Interface :
USB
Mounting Type :
Surface Mount
Number of I/O :
104
Core Processor :
XCore
Program Memory Type :
Flash
Packaging :
Tray
Memory Size :
2MB
Published :
2015
Core Architecture :
XCore
Program Memory Size :
2MB 2M x 8
RAM Size :
256K x 8
Core Size :
32-Bit 16-Core
Factory Lead Time :
12 Weeks
Min Operating Temperature :
0°C
RoHS Status :
ROHS3 Compliant
Memory Type :
Flash
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
XUF
Speed :
2000MIPS
Voltage - Supply (Vcc/Vdd) :
0.95V~3.6V
Number of Pins :
236
Supplier Device Package :
236-FBGA (10x10)
Oscillator Type :
External
Max Operating Temperature :
70°C
Introducing Microcontrollers XMOS XUF216-256-FB236-C20 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:236-LFBGA, Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, Number of Pins:236, XUF216-256-FB236-C20 pinout, XUF216-256-FB236-C20 datasheet PDF, XUF216-256-FB236-C20 amp .Beyond Microcontrollers XMOS XUF216-256-FB236-C20 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

XMOS XUF216-256-FB236-C20


Microcontrollers XMOS XUF216-256-FB236-C20 Overview

Introducing the Microcontrollers XMOS XUF216-256-FB236-C20, a state-of-the-art microcontroller unit (MCU) designed to tackle the most demanding embedded applications. Engineered by XMOS, this MCU stands out with its 32-bit architecture and a substantial 2MB of embedded flash memory. The compact 236FBGA package encapsulates a powerful combination of performance and versatility, making it an ideal choice for developers looking for high-speed processing capabilities in audio, automotive, and industrial applications. The XUF216-256-FB236-C20 is tailored to enhance multitasking in complex embedded systems by leveraging its dual-issue, 16-core xCORE architecture, ensuring efficient and reliable performance across various use cases.

XUF216-256-FB236-C20 Features

The XUF216-256-FB236-C20 microcontroller by XMOS is equipped with several key features that make it highly effective for sophisticated embedded solutions. It boasts a 32-bit xCORE-200 processor, designed for real-time multitasking and parallel processing. With 2MB of on-chip flash memory and a high-speed interface, this MCU supports intensive data management and quick communication protocols. Its 236FBGA packaging not only ensures a compact footprint but also offers enhanced thermal management, crucial for maintaining reliability and performance in tightly integrated systems.

XUF216-256-FB236-C20 Applications

  • Advanced Audio Equipment: The high-speed, multi-core capabilities of the XUF216 make it perfect for advanced audio processing tasks in professional audio systems, including mixers and synthesizers, where multiple streams need real-time processing and low-latency input/output.
  • Automotive Systems: Utilized in automotive applications, this MCU can manage sensor data integration and real-time processing for advanced driver-assistance systems (ADAS), offering robust performance that enhances vehicle safety and functionality.
  • Industrial Automation: In industrial settings, the XUF216 is ideal for controlling machinery and processes that require precise, real-time feedback and high levels of computational power to handle multiple tasks simultaneously.
  • Smart Home Devices: For smart home technology, the XUF216 provides the processing power needed for voice recognition and connectivity tasks, ensuring efficient operation of devices such as smart speakers and home automation hubs.
  • IoT Devices: This MCU is also well-suited for Internet of Things (IoT) devices, where it facilitates the integration of multiple sensors and communications interfaces, enabling smarter and more responsive IoT ecosystems.
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