XCV812E-8BG560C

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Mfr.Part #
XCV812E-8BG560C
Manufacturer
AMD Xilinx
Package / Case
560-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 404 I/O 560MBGA
Stock
16,696
In Stock :
16,696

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Time@Peak Reflow Temperature-Max (s) :
30
JESD-609 Code :
e0
Packaging :
Tray
Speed Grade :
8
RoHS Status :
Non-RoHS Compliant
JESD-30 Code :
S-PBGA-B560
Published :
2002
Combinatorial Delay of a CLB-Max :
0.4 ns
RAM Size :
140kB
Number of Gates :
254016
Terminal Pitch :
1.27mm
Clock Frequency :
416MHz
Number of Outputs :
404
Number of Logic Elements/Cells :
21168
ECCN Code :
3A991.D
Operating Temperature :
0°C~85°C TJ
Radiation Hardening :
No
Pbfree Code :
No
Number of LABs/CLBs :
4704
Number of Terminations :
560
Base Part Number :
XCV812E
Total RAM Bits :
1146880
Peak Reflow Temperature (Cel) :
225
Voltage - Supply :
1.71V~1.89V
Terminal Finish :
Tin/Lead (Sn63Pb37)
Number of I/O :
404
Number of Inputs :
404
Lead Free :
Contains Lead
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Package / Case :
560-LBGA Exposed Pad, Metal
Height Seated (Max) :
1.7mm
Terminal Position :
BOTTOM
Width :
42.5mm
Mount :
Surface Mount
Pin Count :
560
Operating Supply Voltage :
1.8V
Terminal Form :
Ball
Length :
42.5mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
Virtex®-E EM
Mounting Type :
Surface Mount
Supply Voltage :
1.8V
Datasheets
XCV812E-8BG560C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV812E-8BG560C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Number of Terminations:560, Base Part Number:XCV812E, Package / Case:560-LBGA Exposed Pad, Metal, Mounting Type:Surface Mount, XCV812E-8BG560C pinout, XCV812E-8BG560C datasheet PDF, XCV812E-8BG560C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV812E-8BG560C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V 1.7mm mm FPGAs Virtex®-E EM Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560

XCV812E-8BG560C Overview


A 560-LBGA Exposed Pad, Metal package contains it, and it is available for download. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Its 404 I/Os help it transfer data more efficiently. A fundamental building block contains 21168 logic elements or cells. Power is provided by a 1.8V-volt supply. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 1.71V~1.89V and uses a battery to supply power. FPGAs belonging to the Virtex®-E EM series are a type of FPGA that belong to the Virtex®-E EM series of FPGAs. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. During the installation of this device, 404 outputs were incorporated. A model of this FPGA is contained in Tray for the purpose of saving space. In total, there are a total of 560 terminations on fpga chips. Having a RAM bit size of 1146880 means that this device will offer you a lot of memory. For related parts, use its base part number XCV812E. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. 4704 LABs/CLBs are integrated into this FPGA. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. With a 1.8V supply voltage, designers can fully utilize the flexibility of the device. 254016 gates make up the basic block of its construction. Featuring 560 pins in total, it is a versatile device. Most commonly, this device makes use of an oscillating crystal frequency of 416MHz to operate.

XCV812E-8BG560C Features


404 I/Os
Up to 1146880 RAM bits


XCV812E-8BG560C Applications


There are a lot of Xilinx Inc.
XCV812E-8BG560C FPGAs applications.


  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
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