XCV800-5FG676C
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- Mfr.Part #
- XCV800-5FG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 444 I/O 676FCBGA
- Stock
- 43,429
- In Stock ：
- 43,429
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Reach Compliance Code :
- not_compliant
- Number of LABs/CLBs :
- 4704
- Pbfree Code :
- No
- Mount :
- Surface Mount
- Number of Gates :
- 888439
- Width :
- 27mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Power Supplies :
- 1.2/3.62.5V
- Published :
- 2000
- Voltage - Supply :
- 2.375V~2.625V
- Total RAM Bits :
- 114688
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Outputs :
- 444
- JESD-30 Code :
- S-PBGA-B676
- Packaging :
- Tray
- RAM Size :
- 14kB
- Length :
- 27mm
- Qualification Status :
- Not Qualified
- Combinatorial Delay of a CLB-Max :
- 0.7 ns
- Number of Terminations :
- 676
- Pin Count :
- 676
- JESD-609 Code :
- e0
- Package / Case :
- 676-BBGA, FCBGA
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- ECCN Code :
- EAR99
- Number of Logic Elements/Cells :
- 21168
- Number of I/O :
- 444
- Number of Inputs :
- 444
- Clock Frequency :
- 294MHz
- Series :
- Virtex®
- Terminal Pitch :
- 1mm
- Lead Free :
- Contains Lead
- Height Seated (Max) :
- 2.6mm
- RoHS Status :
- Non-RoHS Compliant
- HTS Code :
- 8542.39.00.01
- Operating Temperature :
- 0°C~85°C TJ
- Mounting Type :
- Surface Mount
- Terminal Form :
- Ball
- Terminal Position :
- BOTTOM
- Peak Reflow Temperature (Cel) :
- 225
- Supply Voltage :
- 2.5V
- Base Part Number :
- XCV800
- Datasheets
- XCV800-5FG676C
FPGAs AMD Xilinx XCV800-5FG676C Overview
The FPGAs AMD Xilinx XCV800-5FG676C is a highly capable integrated circuit designed for robust field-programmable gate array (FPGA) applications. Manufactured by AMD Xilinx, this FPGA excels in delivering exceptional performance and flexibility. It supports a broad array of applications thanks to its dense logic capacity and high I/O bandwidth. This model comes in a 676-pin flip-chip ball grid array (FCBGA) package, which enhances its reliability and thermal performance in demanding environments. The XCV800-5FG676C is engineered to meet the complex and evolving needs of modern digital systems, providing designers with the ability to optimize their hardware acceleration and system integration tasks effectively.
XCV800-5FG676C Features
This FPGA features a comprehensive set of capabilities tailored for high-speed and complex digital processing tasks. Key features include a total of 444 configurable I/O ports, facilitating extensive interfacing with other digital components. Additionally, the high-density logic cells embedded within allow for efficient data handling and processing, which is critical for advanced computing applications. The package's 676FCBGA format ensures robust physical integration and enhanced durability, making it suitable for industrial-grade applications.
XCV800-5FG676C Applications
- Telecommunications Equipment: The high I/O count and flexible logic configuration enable this FPGA to handle multiple data streams simultaneously, which is essential for routers, switches, and base station developments.
- Data Centers: Suitable for acceleration hardware, this FPGA can be deployed in servers to speed up data processing and increase the efficiency of cloud computing solutions.
- Automotive Technology: Can be used in advanced driver-assistance systems (ADAS) to process real-time sensor data and support decision-making processes in autonomous and semi-autonomous vehicles.
- Consumer Electronics: Ideal for high-definition video processing and complex digital signal management in devices such as smartphones, tablets, and smart TVs.
- Industrial Automation: Helps in the management and control of industrial robotics and machinery, ensuring high precision and operational reliability in production lines.
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