XCV300E-6FG456C
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- Mfr.Part #
- XCV300E-6FG456C
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 312 I/O 456FBGA
- Stock
- 5,142
- In Stock ：
- 5,142
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Terminations :
- 456
- RAM Size :
- 16kB
- Pbfree Code :
- No
- Number of I/O :
- 312
- Mount :
- Surface Mount
- Radiation Hardening :
- No
- Operating Supply Voltage :
- 1.8V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells :
- 6912
- Terminal Form :
- Ball
- Mounting Type :
- Surface Mount
- Number of Pins :
- 456
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Width :
- 23mm
- Terminal Position :
- BOTTOM
- Base Part Number :
- XCV300E
- Length :
- 23mm
- RoHS Status :
- Non-RoHS Compliant
- Published :
- 2006
- Package / Case :
- 456-BBGA
- Operating Temperature :
- 0°C~85°C TJ
- Lead Free :
- Contains Lead
- HTS Code :
- 8542.39.00.01
- ECCN Code :
- 3A991.D
- Terminal Pitch :
- 1mm
- Pin Count :
- 456
- Series :
- Virtex®-E
- Number of Equivalent Gates :
- 82944
- Supply Voltage :
- 1.8V
- JESD-609 Code :
- e0
- Voltage - Supply :
- 1.71V~1.89V
- Number of Outputs :
- 312
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Peak Reflow Temperature (Cel) :
- 225
- Packaging :
- Tray
- Speed Grade :
- 6
- Clock Frequency :
- 357MHz
- Number of LABs/CLBs :
- 1536
- Total RAM Bits :
- 131072
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Gates :
- 411955
- Datasheets
- XCV300E-6FG456C
FPGAs AMD Xilinx XCV300E-6FG456C Overview
The AMD Xilinx XCV300E-6FG456C FPGA (Field Programmable Gate Array) represents a pinnacle of flexibility and performance in the modern electronics landscape. Designed to meet the diverse needs of high-speed digital computing environments, this component offers a robust solution for designers looking to harness the power of programmable logic. Its high I/O pin count and dense BGA (Ball Grid Array) packaging make it ideal for complex digital systems that require a high degree of customization and scalability. With the XCV300E-6FG456C, AMD Xilinx continues to drive innovation, providing powerful solutions that enhance both performance and efficiency.
XCV300E-6FG456C Features
The XCV300E-6FG456C FPGA is equipped with 312 programmable I/O pins housed in a compact 456-pin FBGA package, ensuring versatile connectivity and integration capability. The device supports a wide array of design configurations, facilitating the deployment of both simple and complex logic circuits. This flexibility makes the XCV300E-6FG456C an excellent choice for designers looking to push the boundaries of what's possible in digital and mixed-signal applications.
XCV300E-6FG456C Applications
- Data Centers: Employed in data processing units for handling vast amounts of data efficiently. Its high I/O capacity enables it to manage multiple data streams, optimizing data throughput and storage systems.
- Telecommunications: Utilized in communication infrastructure to enhance signal processing capabilities. The FPGA can be programmed to support various communication protocols, improving bandwidth and reducing latency.
- Automotive Applications: Integrated in advanced driver-assistance systems (ADAS) to process real-time sensory data and provide quick response actions, enhancing vehicle safety and performance.
- Industrial Automation: Key component in control systems where customization and quick reprogramming are required. Supports robust and reliable operations in harsh industrial environments.
- Medical Devices: Used in medical imaging systems, such as MRI and ultrasound, for fast and efficient processing of complex imaging data, improving diagnostic capabilities and patient outcomes.
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