XCV300-4FG456I
- Mfr.Part #
- XCV300-4FG456I
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 312 I/O 456FBGA
- Stock
- 5,988
- In Stock :
- 5,988
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Clock Frequency :
- 250MHz
- Mounting Type :
- Surface Mount
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Pbfree Code :
- No
- JESD-609 Code :
- e0
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Package / Case :
- 456-BBGA
- RoHS Status :
- Non-RoHS Compliant
- Radiation Hardening :
- No
- Packaging :
- Tray
- Terminal Form :
- Ball
- Number of Gates :
- 322970
- Number of LABs/CLBs :
- 1536
- Total RAM Bits :
- 65536
- ECCN Code :
- EAR99
- Peak Reflow Temperature (Cel) :
- 225
- Length :
- 23mm
- Operating Supply Voltage :
- 2.5V
- Voltage - Supply :
- 2.375V~2.625V
- Number of I/O :
- 312
- Number of Outputs :
- 312
- Number of Logic Elements/Cells :
- 6912
- Speed Grade :
- 4
- Combinatorial Delay of a CLB-Max :
- 0.8 ns
- Number of Pins :
- 456
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Series :
- Virtex®
- Published :
- 2002
- Pin Count :
- 456
- Operating Temperature :
- -40°C~100°C TJ
- Supply Voltage :
- 2.5V
- Number of Terminations :
- 456
- Base Part Number :
- XCV300
- Terminal Pitch :
- 1mm
- RAM Size :
- 8kB
- Mount :
- Surface Mount
- Width :
- 23mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Lead Free :
- Contains Lead
- Height Seated (Max) :
- 2.6mm
- Terminal Position :
- BOTTOM
- Datasheets
- XCV300-4FG456I

FPGAs AMD Xilinx XCV300-4FG456I Overview
The FPGAs AMD Xilinx XCV300-4FG456I is a highly versatile field programmable gate array (FPGA) that is designed to meet the demanding requirements of modern digital circuits. Manufactured by AMD Xilinx, this device offers a robust platform for developing complex designs with improved programmability and increased functionality. The XCV300-4FG456I is ideal for designers looking to leverage advanced FPGA technology for high-performance applications in a compact 456-pin FBGA (Fine Ball Grid Array) package. This product facilitates efficient design implementations, providing a flexible and cost-effective solution for a wide range of applications.
XCV300-4FG456I Features
The XCV300-4FG456I FPGA features 312 user I/Os, allowing extensive connectivity and integration options for various system peripherals and interfaces. Its 456FBGA package ensures a minimal footprint on system boards, making it suitable for space-constrained applications. The FPGA supports a wide range of design configurations, empowering developers with the tools to optimize performance and power consumption according to specific project needs.
XCV300-4FG456I Applications
- Data Processing: Utilized in servers and data centers, the XCV300-4FG456I enhances data processing capabilities, facilitating faster and more efficient data handling and throughput.
- Telecommunications: Integral to communication infrastructure, this FPGA supports complex algorithms required for signal processing and network management, improving bandwidth and system reliability.
- Consumer Electronics: In consumer devices such as smart TVs and gaming consoles, the XCV300-4FG456I helps in managing high-speed signal processing, enhancing user experience with superior performance and graphics quality.
- Automotive Systems: This FPGA is applied in advanced driver-assistance systems (ADAS) to process real-time data from vehicle sensors, aiding in decision making and system responsiveness.
- Industrial Automation: The XCV300-4FG456I facilitates the control and management of machinery in automated production lines, ensuring precision and efficiency in high-volume manufacturing environments.
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