XCV300E-6FG256I
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- Mfr.Part #
- XCV300E-6FG256I
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 176 I/O 256FBGA
- Stock
- 37,009
- In Stock ：
- 37,009
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Lead Free :
- Contains Lead
- ECCN Code :
- EAR99
- Operating Temperature :
- -40°C~100°C TJ
- Number of Outputs :
- 176
- Terminal Position :
- BOTTOM
- Voltage - Supply :
- 1.71V~1.89V
- Packaging :
- Tray
- Number of Terminations :
- 256
- Clock Frequency :
- 357MHz
- Terminal Form :
- Ball
- HTS Code :
- 8542.39.00.01
- Series :
- Virtex®-E
- Number of LABs/CLBs :
- 1536
- Number of Logic Elements/Cells :
- 6912
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Mount :
- Surface Mount
- Published :
- 2006
- JESD-609 Code :
- e0
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Base Part Number :
- XCV300E
- Supply Voltage :
- 1.8V
- Number of Pins :
- 256
- Number of I/O :
- 176
- RoHS Status :
- Non-RoHS Compliant
- RAM Size :
- 16kB
- Mounting Type :
- Surface Mount
- Pbfree Code :
- No
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Peak Reflow Temperature (Cel) :
- 225
- Operating Supply Voltage :
- 1.8V
- Length :
- 17mm
- Terminal Pitch :
- 1mm
- Number of Gates :
- 411955
- Speed Grade :
- 6
- Total RAM Bits :
- 131072
- Number of Equivalent Gates :
- 82944
- Pin Count :
- 256
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Package / Case :
- 256-BGA
- Height Seated (Max) :
- 2mm
- Width :
- 17mm
- Radiation Hardening :
- No
- Datasheets
- XCV300E-6FG256I
FPGAs AMD Xilinx XCV300E-6FG256I Overview
The AMD Xilinx XCV300E-6FG256I is a high-performance FPGA (Field Programmable Gate Array) designed to meet the intensive demands of modern digital circuits. With a robust 256FBGA package, it offers ample I/O capabilities with 176 inputs and outputs, making it an excellent choice for designers looking to implement complex logic designs and data processing algorithms. The integration of advanced technology in the XCV300E-6FG256I allows for superior performance, flexibility, and scalability, which are essential for applications requiring high-speed data transmission and processing. This FPGA is tailored to assist engineers in creating more efficient, reliable, and scalable electronic solutions.
XCV300E-6FG256I Features
The XCV300E-6FG256I from AMD Xilinx boasts several key features that make it a top contender in the FPGA market. These include its 256FBGA packaging which enhances the robustness and durability of the module, 176 I/O pins enabling versatile connectivity options, and high-speed performance suitable for a wide range of applications. Additionally, the FPGA is designed for low power consumption, making it ideal for power-sensitive applications.
XCV300E-6FG256I Applications
- Telecommunications Infrastructure: Utilized in routers and switches for processing high-speed data and managing multiple data streams efficiently.
- Automotive Electronics: Integrated into driver assistance systems to process sensor data and support real-time decision making.
- Industrial Automation: Serves as the core processing unit in complex industrial machines for handling control tasks and real-time operations.
- Consumer Electronics: Used in high-definition multimedia interfaces and gaming consoles to enhance graphical processing and user experience.
- Medical Devices: Forms part of diagnostic equipment where high-speed data processing and precise control are crucial.
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