XCV2000E-8BG560C

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Mfr.Part #
XCV2000E-8BG560C
Manufacturer
AMD Xilinx
Package / Case
560-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 404 I/O 560MBGA
Stock
40,265
In Stock :
40,265

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Published :
2004
Peak Reflow Temperature (Cel) :
225
Operating Supply Voltage :
1.8V
Pbfree Code :
No
Number of LABs/CLBs :
9600
Supply Voltage :
1.8V
Number of Terminations :
560
Pin Count :
560
Terminal Finish :
Tin/Lead (Sn63Pb37)
Height Seated (Max) :
1.7mm
Terminal Pitch :
1.27mm
Packaging :
Tray
Combinatorial Delay of a CLB-Max :
0.4 ns
Number of Inputs :
404
Total RAM Bits :
655360
Clock Frequency :
416MHz
Number of I/O :
404
Width :
42.5mm
Number of Outputs :
404
Operating Temperature :
0°C~85°C TJ
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Form :
Ball
Length :
42.5mm
JESD-609 Code :
e0
Mounting Type :
Surface Mount
Number of Logic Elements/Cells :
43200
ECCN Code :
EAR99
Series :
Virtex®-E
JESD-30 Code :
S-PBGA-B560
RoHS Status :
Non-RoHS Compliant
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Radiation Hardening :
No
Terminal Position :
BOTTOM
RAM Size :
80kB
Time@Peak Reflow Temperature-Max (s) :
30
Base Part Number :
XCV2000E
Package / Case :
560-LBGA Exposed Pad, Metal
Speed Grade :
8
Mount :
Surface Mount
Voltage - Supply :
1.71V~1.89V
Number of Gates :
2541952
Lead Free :
Contains Lead
Datasheets
XCV2000E-8BG560C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV2000E-8BG560C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:560, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Base Part Number:XCV2000E, Package / Case:560-LBGA Exposed Pad, Metal, XCV2000E-8BG560C pinout, XCV2000E-8BG560C datasheet PDF, XCV2000E-8BG560C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV2000E-8BG560C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V 1.7mm mm FPGAs Virtex®-E Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560

XCV2000E-8BG560C Overview


A 560-LBGA Exposed Pad, Metal package is provided with this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. This device features 404 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 43200 logic elements/cells. An electrical supply voltage of 1.8V powers it. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 1.71V~1.89V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the Virtex®-E series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. In order to make this device as versatile as possible, there are 404 different outputs included. It is for space saving reasons that this FPGA model is contained in Tray. As a whole, it has 560 terminations. The RAM bits that are offered by this fpga chips are 655360. Related parts can be found by using its base part number XCV2000E. The FPGA module's RAM si80kBe reaches 80kB in order to ensure that the program operates in a normal manner. Fpga electronics contains 9600 LABs/CLBs in an array. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. A 1.8V-volt supply allows designers to fully utilize its flexibility. Among its basic building blocks, there are 2541952 gates that are included in it. In addition to this, it has 560 pins. Normally, fpga semiconductor uses an oscillator, which oscillates at 416MHz, to create the signal.

XCV2000E-8BG560C Features


404 I/Os
Up to 655360 RAM bits


XCV2000E-8BG560C Applications


There are a lot of Xilinx Inc.
XCV2000E-8BG560C FPGAs applications.


  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
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