XCV200-4BG352I
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- Mfr.Part #
- XCV200-4BG352I
- Manufacturer
- AMD Xilinx
- Package / Case
- 352-LBGA Exposed Pad, Metal
- Datasheet
- Download
- Description
- IC FPGA 260 I/O 352MBGA
- Stock
- 1,009
- In Stock ：
- 1,009
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Peak Reflow Temperature (Cel) :
- 225
- Clock Frequency :
- 250MHz
- Combinatorial Delay of a CLB-Max :
- 0.8 ns
- Number of I/O :
- 260
- RAM Size :
- 7kB
- Number of Inputs :
- 260
- Lead Free :
- Contains Lead
- Supply Voltage :
- 2.5V
- Terminal Form :
- Ball
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Voltage - Supply :
- 2.375V~2.625V
- RoHS Status :
- Non-RoHS Compliant
- Pin Count :
- 352
- Packaging :
- Tray
- Total RAM Bits :
- 57344
- Number of Terminations :
- 352
- Operating Supply Voltage :
- 2.5V
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Gates :
- 236666
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Height Seated (Max) :
- 1.7mm
- Mount :
- Surface Mount
- Number of LABs/CLBs :
- 1176
- Terminal Position :
- BOTTOM
- Base Part Number :
- XCV200
- Series :
- Virtex®
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Pbfree Code :
- No
- Radiation Hardening :
- No
- Package / Case :
- 352-LBGA Exposed Pad, Metal
- Width :
- 35mm
- Number of Outputs :
- 260
- Published :
- 2000
- JESD-609 Code :
- e0
- JESD-30 Code :
- S-PBGA-B352
- Number of Logic Elements/Cells :
- 5292
- Terminal Pitch :
- 1.27mm
- Length :
- 35mm
- Operating Temperature :
- -40°C~100°C TJ
- Mounting Type :
- Surface Mount
- Speed Grade :
- 4
- Datasheets
- XCV200-4BG352I
2.5V V 1.7mm mm FPGAs Virtex® Series 352-LBGA Exposed Pad, Metal 1.27mm mm 352
XCV200-4BG352I Overview
Fpga chips is supplied in the 352-LBGA Exposed Pad, Metal package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 260 I/Os for transferring data in a more coherent manner. There are 5292 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 2.5V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 2.375V~2.625V. It is a type of FPGA belonging to the Virtex® seies. The operating temperature should be kept at -40°C~100°C TJ when operating. There are 260 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 352 terminations. The RAM bits that this device offer is 57344. Its base part number XCV200 can be used to find related parts. The RAM si7kBe of this FPGA module reaches 7kB to ensure normal operation of the program. This FPGA is built as an array of 1176 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 2.5V, designers can fully make use of its flexibility. Its basic building block contains 236666 gates. Fpga semiconductor is equipped wfpga semiconductorh 352 pin count. Typically, fpga semiconductor uses a crystal oscillating at 250MHz .
XCV200-4BG352I Features
260 I/Os
Up to 57344 RAM bits
XCV200-4BG352I Applications
There are a lot of Xilinx Inc.
XCV200-4BG352I FPGAs applications.
- Digital signal processing
- Bioinformatics
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
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