XCV2000E-7FG860C

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Mfr.Part #
XCV2000E-7FG860C
Manufacturer
AMD Xilinx
Package / Case
860-BGA
Datasheet
Download
Description
IC FPGA 660 I/O 860FBGA
Stock
5,410
In Stock :
5,410

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
RoHS Status :
Non-RoHS Compliant
Number of I/O :
660
RAM Size :
80kB
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Inputs :
660
Number of Equivalent Gates :
518400
Qualification Status :
Not Qualified
Clock Frequency :
400MHz
JESD-30 Code :
S-PBGA-B860
Terminal Form :
Ball
Number of Outputs :
660
Total RAM Bits :
655360
Base Part Number :
XCV2000E
Terminal Pitch :
1mm
Published :
2004
Number of Logic Elements/Cells :
43200
Lead Free :
Contains Lead
Terminal Position :
BOTTOM
Number of Terminations :
860
Mount :
Surface Mount
Power Supplies :
1.2/3.61.8V
Peak Reflow Temperature (Cel) :
225
Pin Count :
860
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of LABs/CLBs :
9600
Time@Peak Reflow Temperature-Max (s) :
30
Package / Case :
860-BGA
Series :
Virtex®-E
Voltage - Supply :
1.71V~1.89V
Width :
42.5mm
Supply Voltage :
1.8V
ECCN Code :
3A001.A.7.A
HTS Code :
8542.39.00.01
Operating Temperature :
0°C~85°C TJ
Combinatorial Delay of a CLB-Max :
0.42 ns
Height Seated (Max) :
2.2mm
Length :
42.5mm
Mounting Type :
Surface Mount
Reach Compliance Code :
not_compliant
Number of Gates :
2541952
Terminal Finish :
Tin/Lead (Sn63Pb37)
Packaging :
Tray
JESD-609 Code :
e0
Datasheets
XCV2000E-7FG860C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV2000E-7FG860C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XCV2000E, Number of Terminations:860, Package / Case:860-BGA, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, XCV2000E-7FG860C pinout, XCV2000E-7FG860C datasheet PDF, XCV2000E-7FG860C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV2000E-7FG860C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



2.2mm mm FPGAs Virtex®-E Series 860-BGA 1mm mm 860

XCV2000E-7FG860C Overview


Fpga chips is supplied in the 860-BGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 660 I/Os for transferring data in a more coherent manner. There are 43200 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.8V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.71V~1.89V. It is a type of FPGA belonging to the Virtex®-E seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 660 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 860 terminations. The RAM bits that this device offer is 655360. Its base part number XCV2000E can be used to find related parts. The RAM si80kBe of this FPGA module reaches 80kB to ensure normal operation of the program. This FPGA is built as an array of 9600 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. Fpga electronics operates from a 1.2/3.61.8V power supply. Its basic building block contains 2541952 gates. Fpga semiconductor is equipped wfpga semiconductorh 860 pin count. Typically, fpga semiconductor uses a crystal oscillating at 400MHz . 518400 equivalent gates are used for the design implement in the FPGA.

XCV2000E-7FG860C Features


660 I/Os
Up to 655360 RAM bits


XCV2000E-7FG860C Applications


There are a lot of Xilinx Inc.
XCV2000E-7FG860C FPGAs applications.


  • Digital signal processing
  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
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