XCV2000E-6BG560C

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Mfr.Part #
XCV2000E-6BG560C
Manufacturer
AMD Xilinx
Package / Case
560-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 404 I/O 560MBGA
Stock
23,209
In Stock :
23,209

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Published :
2004
Length :
42.5mm
Number of I/O :
404
HTS Code :
8542.39.00.01
Terminal Position :
BOTTOM
RoHS Status :
Non-RoHS Compliant
Supply Voltage :
1.8V
Mount :
Surface Mount
Packaging :
Tray
Height Seated (Max) :
1.7mm
Total RAM Bits :
655360
Number of Outputs :
404
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Lead Free :
Contains Lead
Terminal Form :
Ball
Pbfree Code :
No
ECCN Code :
EAR99
Speed Grade :
6
Radiation Hardening :
No
JESD-609 Code :
e0
Number of Logic Elements/Cells :
43200
Operating Temperature :
0°C~85°C TJ
Number of Inputs :
404
Number of Terminations :
560
Pin Count :
560
Number of Gates :
2541952
Number of LABs/CLBs :
9600
Base Part Number :
XCV2000E
Terminal Pitch :
1.27mm
Voltage - Supply :
1.71V~1.89V
Package / Case :
560-LBGA Exposed Pad, Metal
RAM Size :
80kB
Number of Equivalent Gates :
518400
Width :
42.5mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Series :
Virtex®-E
Combinatorial Delay of a CLB-Max :
0.47 ns
Time@Peak Reflow Temperature-Max (s) :
30
Clock Frequency :
357MHz
Operating Supply Voltage :
1.8V
Peak Reflow Temperature (Cel) :
225
Datasheets
XCV2000E-6BG560C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV2000E-6BG560C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Number of Terminations:560, Base Part Number:XCV2000E, Package / Case:560-LBGA Exposed Pad, Metal, Mounting Type:Surface Mount, XCV2000E-6BG560C pinout, XCV2000E-6BG560C datasheet PDF, XCV2000E-6BG560C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV2000E-6BG560C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V 1.7mm mm FPGAs Virtex®-E Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560

XCV2000E-6BG560C Overview


A 560-LBGA Exposed Pad, Metal package is provided with this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. This device features 404 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 43200 logic elements/cells. An electrical supply voltage of 1.8V powers it. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 1.71V~1.89V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the Virtex®-E series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. In order to make this device as versatile as possible, there are 404 different outputs included. It is for space saving reasons that this FPGA model is contained in Tray. As a whole, it has 560 terminations. The RAM bits that are offered by this fpga chips are 655360. Related parts can be found by using its base part number XCV2000E. The FPGA module's RAM si80kBe reaches 80kB in order to ensure that the program operates in a normal manner. Fpga electronics contains 9600 LABs/CLBs in an array. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. A 1.8V-volt supply allows designers to fully utilize its flexibility. Among its basic building blocks, there are 2541952 gates that are included in it. In addition to this, it has 560 pins. Normally, fpga semiconductor uses an oscillator, which oscillates at 357MHz, to create the signal. In order to implement this design, 518400 equivalent gates are used in the FPGA.

XCV2000E-6BG560C Features


404 I/Os
Up to 655360 RAM bits


XCV2000E-6BG560C Applications


There are a lot of Xilinx Inc.
XCV2000E-6BG560C FPGAs applications.


  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
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