XCKU5P-3FFVB676E

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Mfr.Part #
XCKU5P-3FFVB676E
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 280 I/O 676FCBGA
Stock
38,324
In Stock :
38,324

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits :
41984000
Package / Case :
676-BBGA, FCBGA
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Operating Temperature :
0°C~100°C TJ
Number of I/O :
280
Number of Logic Elements/Cells :
474600
Voltage - Supply :
0.825V~0.876V
HTS Code :
8542.39.00.01
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Factory Lead Time :
11 Weeks
RoHS Status :
ROHS3 Compliant
Packaging :
Tray
Series :
Kintex® UltraScale+™
Number of LABs/CLBs :
27120
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Datasheets
XCKU5P-3FFVB676E
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU5P-3FFVB676E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:676-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, Mounting Type:Surface Mount, XCKU5P-3FFVB676E pinout, XCKU5P-3FFVB676E datasheet PDF, XCKU5P-3FFVB676E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU5P-3FFVB676E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU5P-3FFVB676E


FPGAs AMD Xilinx XCKU5P-3FFVB676E Overview

The AMD Xilinx XCKU5P-3FFVB676E represents a cutting-edge solution within the field of Field Programmable Gate Arrays (FPGAs), designed to cater to complex digital circuits with a need for flexible and rapid prototyping capabilities. This model is housed in a 676-pin FCBGA (Flip-Chip Ball Grid Array) package, providing robust support for a wide array of I/O options with up to 280 available. It offers exceptional performance for applications requiring high-speed signal processing and real-time data manipulation. Ideal for developers looking to push the boundaries of hardware acceleration, the XCKU5P-3FFVB676E is engineered to optimize power and performance efficiency across diverse operational environments.

XCKU5P-3FFVB676E Features

This FPGA unit is designed for versatility and high performance, integrating numerous features that support advanced digital computing needs:

  • High I/O Pin Count: Features 280 I/O pins, allowing extensive connectivity for various components and peripheral devices.
  • Compact 676-FCBGA Package: Ensures a minimal footprint on system boards, ideal for dense circuit designs.
  • Advanced Configuration Options: Supports numerous configuration settings, enabling highly customized implementations tailored to specific needs.
  • Energy Efficient: Optimized power management for reduced operational costs and enhanced sustainability.

XCKU5P-3FFVB676E Applications

  • Telecommunications: Used in the infrastructure of 5G networks, enhancing data throughput and reliability through advanced signal processing capabilities.
  • Automotive Systems: Employs in driver assistance systems (ADAS), providing the necessary computing power to process real-time sensor data for safer driving experiences.
  • Data Centers: Facilitates accelerated computing tasks, improving efficiency in data processing operations crucial for server farms and cloud services.
  • Consumer Electronics: Integrated into smart home devices, enabling complex logic operations that support increased device intelligence and connectivity.
  • Industrial Automation: Applied in control systems to handle precise and variable processing tasks, improving operational efficiency and productivity in manufacturing processes.
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