XCKU035-3FBVA676E
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- Mfr.Part #
- XCKU035-3FBVA676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 312 I/O 676FCBGA
- Stock
- 9,287
- In Stock ：
- 9,287
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Outputs :
- 312
- Terminal Pitch :
- 1mm
- Mounting Type :
- Surface Mount
- Operating Supply Voltage :
- 950mV
- Length :
- 27mm
- Number of LABs/CLBs :
- 25391
- Terminal Form :
- Ball
- Organization :
- 1700 CLBS
- Series :
- Kintex® UltraScale™
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of Registers :
- 406256
- Mount :
- Surface Mount
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Qualification Status :
- Not Qualified
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Packing Method :
- Tray
- Terminal Position :
- BOTTOM
- Number of I/O :
- 312
- Power Supplies :
- 1V
- Number of Logic Elements/Cells :
- 444343
- JESD-609 Code :
- e1
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Total RAM Bits :
- 19456000
- Contact Plating :
- Copper, Silver, Tin
- Voltage - Supply :
- 0.970V~1.030V
- Packaging :
- Bulk
- Height Seated (Max) :
- 2.71mm
- Number of CLBs :
- 1700
- Supply Voltage :
- 1V
- Factory Lead Time :
- 10 Weeks
- Number of Terminations :
- 676
- RoHS Status :
- ROHS3 Compliant
- Width :
- 27mm
- Package / Case :
- 676-BBGA, FCBGA
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- RAM Size :
- 2.4MB
- Operating Temperature :
- 0°C~100°C TJ
- Number of Pins :
- 676
- Speed Grade :
- 3
- Published :
- 2012
- Datasheets
- XCKU035-3FBVA676E
FPGAs AMD Xilinx XCKU035-3FBVA676E Overview
The FPGAs AMD Xilinx XCKU035-3FBVA676E is a high-performance, field-programmable gate array designed by the renowned semiconductor manufacturer, AMD Xilinx. This integrated circuit is tailored for advanced system-level applications that demand high I/O bandwidth and adaptable interconnectivity. With a total of 312 I/Os housed in a compact 676-pin flip-chip BGA (FCBGA) package, this FPGA enables efficient, scalable solutions for a variety of demanding applications. It combines flexibility with power efficiency, making it ideal for designers looking to balance performance and power consumption in their next-generation electronic products.
XCKU035-3FBVA676E Features
The XCKU035-3FBVA676E FPGA from AMD Xilinx boasts several key features that make it an excellent choice for both complex industrial applications and high-speed data processing tasks. This includes an advanced node designed to provide significant improvements in speed and power efficiency, a high number of input/output ports for greater design flexibility, and support for a variety of programming languages and design tools, ensuring ease of integration into diverse development environments.
XCKU035-3FBVA676E Applications
- Data Centers: Utilized in server architectures to accelerate data processing and reduce latency, improving overall efficiency and throughput.
- Telecommunications: Employs in network infrastructure to support high-speed signal processing, increasing bandwidth and reducing bottlenecks.
- Automotive: Integrated in driver assistance systems to perform real-time image processing and sensor data analysis, enhancing vehicle safety and automation.
- Industrial Automation: Used in control systems to manage complex operations, optimize manufacturing processes, and increase system reliability and adaptability.
- Medical Devices: Applied in medical imaging equipment, helping to process complex diagnostic data and support real-time decision-making for healthcare professionals.
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