XC17S50APDG8C

Manufacturer :

AMD Xilinx

Product Category :

Configuration Proms for FPGAs

Density :

1 Mb

Peak Reflow Temperature (Cel) :

250

Output Characteristics :

3-STATE

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Number of Functions :

1

Height Seated (Max) :

4.5974mm

Supply Current-Max :

0.015mA

Pin Count :

8

Standby Current-Max :

0.001A

Time@Peak Reflow Temperature-Max (s) :

30

Terminal Pitch :

2.54mm

Supply Voltage-Min (Vsup) :

3V

Packaging :

Tube

Organization :

559200X1

Parallel/Serial :

Serial

Terminal Position :

Dual

Terminal Finish :

Matte Tin (Sn)

ECCN Code :

EAR99

Operating Temperature :

0°C~70°C

Base Part Number :

XC17S50A

Programmable Type :

OTP

Surface Mount :

No

Pbfree Code :

yes

Operating Supply Voltage :

3.3V

Width :

7.62mm

Package / Case :

8-DIP (0.300, 7.62mm)

Memory IC Type :

CONFIGURATION MEMORY

Memory Size :

500kb

RoHS Status :

RoHS Compliant

Number of Terminations :

8

Published :

1999

I/O Type :

COMMON

Supply Voltage-Max (Vsup) :

3.6V

Memory Width :

1

Supply Voltage :

3.3V

Mounting Type :

Through Hole

JESD-609 Code :

e3

Voltage - Supply :

3V~3.6V

Number of Pins :

8

Radiation Hardening :

No

Length :

9.3599mm