XC17S50APDG8C

Manufacturer :

AMD Xilinx

Product Category :

Configuration Proms for FPGAs

Time@Peak Reflow Temperature-Max (s) :

30

Supply Current-Max :

0.015mA

Supply Voltage-Min (Vsup) :

3V

Published :

1999

Operating Temperature :

0°C~70°C

Number of Functions :

1

Terminal Finish :

Matte Tin (Sn)

Parallel/Serial :

Serial

Height Seated (Max) :

4.5974mm

Standby Current-Max :

0.001A

ECCN Code :

EAR99

Supply Voltage :

3.3V

JESD-609 Code :

e3

Surface Mount :

No

Width :

7.62mm

Peak Reflow Temperature (Cel) :

250

Number of Pins :

8

Organization :

559200X1

Terminal Pitch :

2.54mm

Pin Count :

8

Length :

9.3599mm

Operating Supply Voltage :

3.3V

Memory IC Type :

CONFIGURATION MEMORY

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Base Part Number :

XC17S50A

Pbfree Code :

yes

RoHS Status :

RoHS Compliant

Radiation Hardening :

No

Memory Size :

500kb

Memory Width :

1

Packaging :

Tube

Supply Voltage-Max (Vsup) :

3.6V

Mounting Type :

Through Hole

I/O Type :

COMMON

Number of Terminations :

8

Programmable Type :

OTP

Terminal Position :

Dual

Voltage - Supply :

3V~3.6V

Density :

1 Mb

Output Characteristics :

3-STATE

Package / Case :

8-DIP (0.300, 7.62mm)