XC17S50APDG8C

Manufacturer :

AMD Xilinx

Product Category :

Configuration Proms for FPGAs

Radiation Hardening :

No

Memory IC Type :

CONFIGURATION MEMORY

Number of Terminations :

8

Package / Case :

8-DIP (0.300, 7.62mm)

Supply Voltage-Min (Vsup) :

3V

Supply Voltage :

3.3V

RoHS Status :

RoHS Compliant

Terminal Position :

Dual

Voltage - Supply :

3V~3.6V

ECCN Code :

EAR99

Terminal Finish :

Matte Tin (Sn)

Published :

1999

Base Part Number :

XC17S50A

Mounting Type :

Through Hole

Density :

1 Mb

Memory Size :

500kb

Operating Supply Voltage :

3.3V

Supply Voltage-Max (Vsup) :

3.6V

Width :

7.62mm

Pbfree Code :

yes

Time@Peak Reflow Temperature-Max (s) :

30

I/O Type :

COMMON

Height Seated (Max) :

4.5974mm

Surface Mount :

No

Number of Functions :

1

Packaging :

Tube

Output Characteristics :

3-STATE

Terminal Pitch :

2.54mm

Peak Reflow Temperature (Cel) :

250

Programmable Type :

OTP

Number of Pins :

8

Organization :

559200X1

Operating Temperature :

0°C~70°C

Parallel/Serial :

Serial

Pin Count :

8

Length :

9.3599mm

Memory Width :

1

Supply Current-Max :

0.015mA

JESD-609 Code :

e3

Standby Current-Max :

0.001A

Moisture Sensitivity Level (MSL) :

1 (Unlimited)