XC1701LPDG8C

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Mfr.Part #
XC1701LPDG8C
Manufacturer
AMD Xilinx
Package / Case
8-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC PROM SER CONFIG 1M 3.3V 8-DIP
Stock
29,044
In Stock :
29,044

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
Package / Case :
8-DIP (0.300, 7.62mm)
Width :
7.62mm
Published :
2004
Programmable Type :
OTP
Supply Voltage-Max (Vsup) :
3.6V
Clock Frequency :
15MHz
Memory IC Type :
CONFIGURATION MEMORY
Number of Pins :
8
Standby Current-Max :
0.00005A
Surface Mount :
No
Packaging :
Tube
Time@Peak Reflow Temperature-Max (s) :
30
Parallel/Serial :
Serial
Terminal Finish :
Matte Tin (Sn)
Voltage - Supply :
3V~3.6V
Additional Feature :
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Length :
9.3599mm
Memory Width :
1
Number of Terminations :
8
Base Part Number :
XC1701L
Organization :
1MX1
Qualification Status :
Not Qualified
Supply Voltage-Min (Vsup) :
3V
Pin Count :
8
Power Supplies :
3.3V
I/O Type :
COMMON
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
JESD-609 Code :
e3
RoHS Status :
RoHS Compliant
Mounting Type :
Through Hole
Memory Size :
1Mb
Terminal Pitch :
2.54mm
Height Seated (Max) :
4.5974mm
Operating Mode :
SYNCHRONOUS
Number of Functions :
1
Terminal Position :
Dual
Output Characteristics :
3-STATE
Supply Current-Max :
0.01mA
Pbfree Code :
yes
Operating Temperature :
0°C~70°C
Supply Voltage :
3.3V
Peak Reflow Temperature (Cel) :
250
Datasheets
XC1701LPDG8C
Introducing Configuration Proms for FPGAs AMD Xilinx XC1701LPDG8C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:8-DIP (0.300, 7.62mm), Number of Pins:8, Number of Terminations:8, Base Part Number:XC1701L, Mounting Type:Through Hole, Operating Temperature:0°C~70°C, XC1701LPDG8C pinout, XC1701LPDG8C datasheet PDF, XC1701LPDG8C amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC1701LPDG8C ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC1701LPDG8C


[Configuration Proms for FPGAs AMD Xilinx XC1701LPDG8C] Overview

Introducing the XC1701LPDG8C by AMD Xilinx, a high-performance IC PROM designed for serial configuration of Field-Programmable Gate Arrays (FPGAs). This innovative solution redefines configurability, offering seamless integration and reliable performance in diverse electronic applications.

With a capacity of 1M, operating at 3.3V, and housed in an 8DIP package, this IC PROM caters to the demanding requirements of modern electronic systems. Whether deployed in industrial automation, telecommunications, or automotive electronics, the XC1701LPDG8C delivers unmatched configurability and operational stability.

Unlock the full potential of your FPGA-based designs with the XC1701LPDG8C, setting new standards in configuration reliability and efficiency.

XC1701LPDG8C Features

  • High-performance IC PROM for FPGA configuration
  • 1M capacity with 3.3V operation
  • 8DIP package for easy integration
  • Serial configuration for enhanced flexibility
  • Robust design for reliable performance
  • Compatible with various FPGA platforms
  • Ideal for industrial, telecommunications, and automotive applications

XC1701LPDG8C Applications

  • Industrial Automation: Implement precise control and monitoring functions in manufacturing processes. The XC1701LPDG8C enables rapid FPGA configuration, ensuring seamless operation of automated systems in industrial environments.
  • Telecommunications: Enhance network infrastructure with efficient FPGA configuration solutions. The XC1701LPDG8C facilitates swift reconfiguration of telecom equipment, enabling dynamic adaptation to changing network demands.
  • Automotive Electronics: Power next-generation automotive electronics with reliable FPGA configuration. The XC1701LPDG8C supports quick reprogramming of FPGA-based systems, enabling advanced functionalities such as driver assistance and infotainment.
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