XC17S50APD8I

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Mfr.Part #
XC17S50APD8I
Manufacturer
AMD Xilinx
Package / Case
8-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC PROM SER 50000 I-TEMP 8-DIP
Stock
1,792
In Stock :
1,792

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
Radiation Hardening :
No
Organization :
559200X1
Width :
7.62mm
Supply Current-Max :
0.015mA
Packaging :
Tube
Surface Mount :
No
Programmable Type :
OTP
Length :
9.3599mm
Mounting Type :
Through Hole
Standby Current-Max :
0.001A
Supply Voltage-Min (Vsup) :
3V
Density :
1 Mb
Pbfree Code :
No
Operating Supply Voltage :
3.3V
Number of Pins :
8
Height Seated (Max) :
4.5974mm
Number of Terminations :
8
I/O Type :
COMMON
Peak Reflow Temperature (Cel) :
225
Supply Voltage :
3.3V
Terminal Pitch :
2.54mm
Output Characteristics :
3-STATE
Operating Temperature :
-40°C~85°C
Memory IC Type :
CONFIGURATION MEMORY
Memory Width :
1
Base Part Number :
XC17S50A
JESD-609 Code :
e0
Memory Size :
500kb
Published :
1999
Package / Case :
8-DIP (0.300, 7.62mm)
Terminal Position :
Dual
Parallel/Serial :
Serial
Pin Count :
8
ECCN Code :
EAR99
Moisture Sensitivity Level (MSL) :
Not Applicable
Lead Free :
Contains Lead
Time@Peak Reflow Temperature-Max (s) :
30
Number of Functions :
1
Voltage - Supply :
3V~3.6V
Supply Voltage-Max (Vsup) :
3.6V
RoHS Status :
Non-RoHS Compliant
Datasheets
XC17S50APD8I
Introducing Configuration Proms for FPGAs AMD Xilinx XC17S50APD8I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Number of Pins:8, Number of Terminations:8, Operating Temperature:-40°C~85°C, Base Part Number:XC17S50A, Package / Case:8-DIP (0.300, 7.62mm), XC17S50APD8I pinout, XC17S50APD8I datasheet PDF, XC17S50APD8I amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC17S50APD8I ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC17S50APD8I


Configuration Proms for FPGAs AMD Xilinx XC17S50APD8I Overview

Introducing the cutting-edge Configuration Proms for FPGAs by AMD Xilinx, represented by the Mfr.Part XC17S50APD8I. These Integrated Circuits (ICs) redefine efficiency and reliability in digital design. Crafted with precision and innovation, they offer unparalleled performance in serving as the backbone for FPGA configuration.

AMD Xilinx's dedication to excellence is evident in every aspect of these ICs. From meticulous manufacturing standards to rigorous quality control measures, each XC17S50APD8I is a testament to the commitment to delivering top-tier solutions for the industry's most demanding requirements.

Whether you're a seasoned professional or an aspiring innovator, AMD Xilinx's Configuration Proms for FPGAs provide the stability and flexibility needed to bring your designs to life. Experience the future of digital design with the XC17S50APD8I.

XC17S50APD8I Features

  • Highly reliable IC PROM
  • Suitable for FPGA configuration
  • Temperature range: Industrial (I)
  • Package: 8-DIP
  • Capacity: 50000 ITEMP

XC17S50APD8I Applications

  • FPGA Configuration: The XC17S50APD8I excels in configuring Field-Programmable Gate Arrays (FPGAs), ensuring seamless integration and optimal performance in various digital designs and applications.
  • Embedded Systems Development: Leveraging the reliability and versatility of the XC17S50APD8I, embedded systems developers can streamline the configuration process, enabling faster time-to-market for their products.
  • Industrial Automation: In industrial automation settings, where precision and dependability are paramount, the XC17S50APD8I serves as a critical component in controlling and monitoring systems, ensuring smooth and efficient operations.
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Shipping Cost

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