XC17S50APD8C

Manufacturer :

AMD Xilinx

Product Category :

Configuration Proms for FPGAs

Operating Temperature :

0°C~70°C

Packaging :

Tube

Memory Width :

1

Package / Case :

8-DIP (0.300, 7.62mm)

Width :

7.62mm

Surface Mount :

No

ECCN Code :

EAR99

Moisture Sensitivity Level (MSL) :

Not Applicable

Terminal Position :

Dual

Published :

1999

Base Part Number :

XC17S50A

Programmable Type :

OTP

Output Characteristics :

3-STATE

Supply Voltage :

3.3V

I/O Type :

COMMON

Time@Peak Reflow Temperature-Max (s) :

30

Operating Supply Voltage :

3.3V

Supply Voltage-Min (Vsup) :

3V

Number of Terminations :

8

JESD-609 Code :

e0

Length :

9.3599mm

Number of Pins :

8

RoHS Status :

Non-RoHS Compliant

Lead Free :

Contains Lead

Memory Size :

500kb

Density :

1 Mb

Voltage - Supply :

3V~3.6V

Supply Voltage-Max (Vsup) :

3.6V

Radiation Hardening :

No

Number of Functions :

1

Supply Current-Max :

0.015mA

Mounting Type :

Through Hole

Terminal Pitch :

2.54mm

Peak Reflow Temperature (Cel) :

225

Height Seated (Max) :

4.5974mm

Pbfree Code :

No

Memory IC Type :

CONFIGURATION MEMORY

Organization :

559200X1

Pin Count :

8

Standby Current-Max :

0.001A

Parallel/Serial :

Serial