XC17S40XLSO20C
- Mfr.Part #
- XC17S40XLSO20C
- Manufacturer
- AMD Xilinx
- Package / Case
- 20-SOIC (0.295, 7.50mm Width)
- Datasheet
- Download
- Description
- IC PROM PROG C-TEMP 3.3V 20-SOIC
- Stock
- 3,855
- In Stock :
- 3,855
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Base Part Number :
- XC17S40XL
- Radiation Hardening :
- No
- RoHS Status :
- Non-RoHS Compliant
- Density :
- 323 kb
- Package / Case :
- 20-SOIC (0.295, 7.50mm Width)
- Programmable Type :
- OTP
- Max Operating Temperature :
- 70°C
- Lead Free :
- Contains Lead
- Mounting Type :
- Surface Mount
- Published :
- 1999
- Voltage - Supply :
- 3V~3.6V
- Supplier Device Package :
- 20-SOIC
- Operating Supply Voltage :
- 3.3V
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Memory Size :
- 400kb
- Number of Pins :
- 20
- Operating Temperature :
- 0°C~70°C
- Packaging :
- Tube
- Min Operating Temperature :
- 0°C
- Datasheets
- XC17S40XLSO20C

[Configuration Proms for FPGAs AMD Xilinx XC17S40XLSO20C] Overview
Introducing the cutting-edge Configuration Proms for FPGAs, brought to you by AMD Xilinx. The XC17S40XLSO20C is a state-of-the-art integrated circuit tailored for programming critical configurations in a range of Field-Programmable Gate Arrays (FPGAs). Designed to meet the rigorous demands of modern electronics, this IC PROM PROG CTEMP 3.3V 20SOIC offers unparalleled reliability, efficiency, and performance.
With its advanced features and robust construction, the XC17S40XLSO20C stands as a testament to AMD Xilinx's commitment to innovation and excellence in the realm of integrated circuits. Whether you're an electronics enthusiast, a seasoned engineer, or a technology-driven enterprise, this versatile solution is poised to elevate your projects to new heights.
[XC17S40XLSO20C] Features
- Highly Reliable: Built to withstand the most demanding operational environments, ensuring consistent performance under varying conditions.
- Efficient Programming: Streamlined programming process facilitates swift configuration updates, optimizing time and resources.
- Wide Compatibility: Compatible with a diverse range of FPGAs, offering flexibility and versatility in integration.
- Temperature Resilience: Capable of operating across a broad temperature range, from extreme cold to elevated heat, without compromising functionality.
- Low Power Consumption: Designed for energy efficiency, minimizing power consumption without sacrificing performance.
- Compact Form Factor: Space-saving 20SOIC package enables seamless integration into compact electronic devices and systems.
[XC17S40XLSO20C] Applications
- Industrial Automation: Implementing critical configurations for FPGA-based control systems, ensuring reliable operation in manufacturing and industrial automation.
- Telecommunications Infrastructure: Facilitating rapid configuration updates in telecommunications infrastructure equipment, enhancing network performance and reliability.
- Embedded Systems: Enabling efficient programming of FPGA-based embedded systems, ideal for applications in automotive, aerospace, and consumer electronics.
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