XC17S40XLPDG8C
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- Mfr.Part #
- XC17S40XLPDG8C
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC PROM PROG C-TEMP 3.3V 8-DIP
- Stock
- 34,843
- In Stock ：
- 34,843
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Interface :
- Serial
- Number of Terminations :
- 8
- Terminal Pitch :
- 2.54mm
- Voltage - Supply :
- 3V~3.6V
- Terminal Finish :
- Matte Tin (Sn)
- Supply Voltage-Max (Vsup) :
- 3.6V
- Memory Width :
- 1
- Width :
- 7.62mm
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- Number of Functions :
- 1
- Surface Mount :
- No
- Standby Current-Max :
- 0.00005A
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- ECCN Code :
- EAR99
- JESD-609 Code :
- e3
- Qualification Status :
- Not Qualified
- Operating Temperature :
- 0°C~70°C
- Power Supplies :
- 3.3V
- Organization :
- 330696X1
- Packaging :
- Tube
- Reach Compliance Code :
- Unknown
- Termination :
- Through Hole
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Memory Density :
- 330696 bit
- Published :
- 1999
- Supply Current-Max :
- 0.005mA
- Lead Free :
- Lead Free
- Operating Mode :
- SYNCHRONOUS
- Number of Pins :
- 8
- Memory Size :
- 400kb
- Supply Voltage-Min (Vsup) :
- 3V
- Output Characteristics :
- 3-STATE
- Height Seated (Max) :
- 4.5974mm
- Supply Voltage :
- 3.3V
- REACH SVHC :
- No SVHC
- Memory Type :
- PROM
- Length :
- 9.3599mm
- Base Part Number :
- XC17S40XL
- RoHS Status :
- RoHS Compliant
- Mounting Type :
- Through Hole
- Terminal Position :
- Dual
- I/O Type :
- COMMON
- Peak Reflow Temperature (Cel) :
- 250
- Pin Count :
- 8
- Programmable Type :
- OTP
- Clock Frequency :
- 10MHz
- Datasheets
- XC17S40XLPDG8C
[Configuration Proms for FPGAs] Overview
Welcome to the realm of cutting-edge electronic solutions with AMD Xilinx's XC17S40XLPDG8C, an IC PROM PROG CTEMP 3.3V 8DIP. Designed for unparalleled performance and reliability, this integrated circuit epitomizes excellence in programmable read-only memory (PROM) technology.
Featuring a robust construction and operating at a nominal voltage of 3.3V, the XC17S40XLPDG8C is engineered to meet the demanding requirements of modern electronic systems. Its compact 8DIP package ensures easy integration into diverse applications, making it an indispensable component for engineers and developers seeking efficient solutions for their projects.
Whether you're delving into FPGA programming or exploring advanced electronic systems, the XC17S40XLPDG8C empowers you with the flexibility and reliability needed to bring your vision to life. Let's delve deeper into its features and explore its wide-ranging applications.
XC17S40XLPDG8C Features
- High-performance PROM technology
- Nominal voltage: 3.3V
- Compact 8DIP package for easy integration
- Robust and reliable design
- Optimized for FPGA configuration
- Enhanced durability for long-term operation
XC17S40XLPDG8C Applications
- FPGA Configuration: The XC17S40XLPDG8C serves as a crucial component in FPGA configuration, enabling seamless programming and reconfiguration of field-programmable gate arrays for a wide range of applications, including telecommunications, automotive, and aerospace.
- Embedded Systems Development: Incorporate the XC17S40XLPDG8C into your embedded systems projects to facilitate efficient program storage and execution in diverse environments, ranging from industrial automation to consumer electronics.
- Data Center Infrastructure: Enhance the performance and reliability of data center infrastructure by leveraging the XC17S40XLPDG8C for storing critical configuration data in servers, switches, and networking equipment, ensuring seamless operation and scalability.
- Automotive Electronics: Ensure the optimal functioning of automotive electronic systems by utilizing the XC17S40XLPDG8C for storing configuration data in engine control units (ECUs), safety systems, and infotainment modules, enhancing vehicle performance, safety, and user experience.
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