XC17S30XLVOG8I

Manufacturer :

AMD Xilinx

Product Category :

Configuration Proms for FPGAs

Length :

4.9mm

RoHS Status :

RoHS Compliant

Supply Voltage-Min (Vsup) :

3V

Standby Current-Max :

0.00005A

Operating Mode :

SYNCHRONOUS

Programmable Type :

OTP

Memory IC Type :

MEMORY CIRCUIT

Peak Reflow Temperature (Cel) :

260

Terminal Pitch :

1.27mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Published :

1998

Supply Voltage :

3.3V

Supply Voltage-Max (Vsup) :

3.6V

Voltage - Supply :

3V~3.6V

Pin Count :

8

Memory Width :

1

Package / Case :

8-SOIC (0.154, 3.90mm Width)

JESD-609 Code :

e3

Surface Mount :

yes

Packaging :

Tray

Memory Size :

300kb

Width :

3.9mm

Number of Terminations :

8

Operating Temperature :

-40°C~85°C

Clock Frequency :

10MHz

Terminal Position :

Dual

Height Seated (Max) :

1.2mm

Output Characteristics :

3-STATE

Base Part Number :

XC17S30XL

Supply Current-Max :

0.005mA

Time@Peak Reflow Temperature-Max (s) :

30

Power Supplies :

3.3V

Number of Pins :

8

I/O Type :

COMMON

Number of Functions :

1

Mounting Type :

Surface Mount

Qualification Status :

Not Qualified

Terminal Finish :

Matte Tin (Sn)

Terminal Form :

Gull wing

ECCN Code :

EAR99