XC17S30XLVOG8I

Manufacturer :

AMD Xilinx

Product Category :

Configuration Proms for FPGAs

Height Seated (Max) :

1.2mm

Terminal Pitch :

1.27mm

Width :

3.9mm

Pin Count :

8

Time@Peak Reflow Temperature-Max (s) :

30

Memory Size :

300kb

Number of Terminations :

8

Programmable Type :

OTP

Qualification Status :

Not Qualified

Supply Current-Max :

0.005mA

Surface Mount :

yes

Length :

4.9mm

Published :

1998

Number of Functions :

1

Base Part Number :

XC17S30XL

Operating Mode :

SYNCHRONOUS

JESD-609 Code :

e3

Terminal Finish :

Matte Tin (Sn)

Supply Voltage-Min (Vsup) :

3V

I/O Type :

COMMON

Memory Width :

1

Output Characteristics :

3-STATE

Memory IC Type :

MEMORY CIRCUIT

ECCN Code :

EAR99

Packaging :

Tray

Package / Case :

8-SOIC (0.154, 3.90mm Width)

RoHS Status :

RoHS Compliant

Supply Voltage :

3.3V

Clock Frequency :

10MHz

Mounting Type :

Surface Mount

Number of Pins :

8

Supply Voltage-Max (Vsup) :

3.6V

Power Supplies :

3.3V

Terminal Position :

Dual

Operating Temperature :

-40°C~85°C

Peak Reflow Temperature (Cel) :

260

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Form :

Gull wing

Standby Current-Max :

0.00005A

Voltage - Supply :

3V~3.6V