XC17S30XLVOG8I

Manufacturer :

AMD Xilinx

Product Category :

Configuration Proms for FPGAs

Memory Size :

300kb

Operating Mode :

SYNCHRONOUS

Height Seated (Max) :

1.2mm

RoHS Status :

RoHS Compliant

Surface Mount :

yes

Number of Functions :

1

Peak Reflow Temperature (Cel) :

260

Terminal Pitch :

1.27mm

Operating Temperature :

-40°C~85°C

I/O Type :

COMMON

Number of Terminations :

8

Memory Width :

1

Time@Peak Reflow Temperature-Max (s) :

30

Base Part Number :

XC17S30XL

JESD-609 Code :

e3

Width :

3.9mm

Supply Current-Max :

0.005mA

Standby Current-Max :

0.00005A

Supply Voltage-Max (Vsup) :

3.6V

Memory IC Type :

MEMORY CIRCUIT

Packaging :

Tray

Number of Pins :

8

Supply Voltage :

3.3V

Clock Frequency :

10MHz

Mounting Type :

Surface Mount

Power Supplies :

3.3V

Programmable Type :

OTP

Voltage - Supply :

3V~3.6V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage-Min (Vsup) :

3V

Output Characteristics :

3-STATE

ECCN Code :

EAR99

Terminal Finish :

Matte Tin (Sn)

Qualification Status :

Not Qualified

Terminal Position :

Dual

Package / Case :

8-SOIC (0.154, 3.90mm Width)

Length :

4.9mm

Published :

1998

Pin Count :

8

Terminal Form :

Gull wing