XC17S30XLVOG8I

Manufacturer :

AMD Xilinx

Product Category :

Configuration Proms for FPGAs

Height Seated (Max) :

1.2mm

Width :

3.9mm

Packaging :

Tray

JESD-609 Code :

e3

Programmable Type :

OTP

Published :

1998

Peak Reflow Temperature (Cel) :

260

Mounting Type :

Surface Mount

Terminal Finish :

Matte Tin (Sn)

Supply Voltage-Min (Vsup) :

3V

Memory IC Type :

MEMORY CIRCUIT

Pin Count :

8

ECCN Code :

EAR99

Power Supplies :

3.3V

Memory Size :

300kb

Time@Peak Reflow Temperature-Max (s) :

30

Surface Mount :

yes

Length :

4.9mm

Supply Current-Max :

0.005mA

Supply Voltage-Max (Vsup) :

3.6V

Operating Temperature :

-40°C~85°C

I/O Type :

COMMON

Package / Case :

8-SOIC (0.154, 3.90mm Width)

Terminal Pitch :

1.27mm

Number of Functions :

1

Base Part Number :

XC17S30XL

Terminal Form :

Gull wing

Output Characteristics :

3-STATE

Supply Voltage :

3.3V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Voltage - Supply :

3V~3.6V

RoHS Status :

RoHS Compliant

Clock Frequency :

10MHz

Qualification Status :

Not Qualified

Number of Pins :

8

Memory Width :

1

Number of Terminations :

8

Operating Mode :

SYNCHRONOUS

Terminal Position :

Dual

Standby Current-Max :

0.00005A