XC17S30XLVOG8C
- Mfr.Part #
- XC17S30XLVOG8C
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- IC PROM SERIAL 3.3V 300K 8-SOIC
- Stock
- 20,205
- In Stock :
- 20,205
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Clock Frequency :
- 10MHz
- Number of Functions :
- 1
- I/O Type :
- COMMON
- Voltage - Supply :
- 3V~3.6V
- Radiation Hardening :
- No
- Supply Current-Max :
- 0.005mA
- Supply Voltage :
- 3.3V
- RoHS Status :
- RoHS Compliant
- Width :
- 3.9mm
- Supply Voltage-Max (Vsup) :
- 3.6V
- Packaging :
- Tray
- Pbfree Code :
- yes
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Length :
- 4.9mm
- Height Seated (Max) :
- 1.2mm
- Terminal Form :
- Gull wing
- Memory Width :
- 1
- Published :
- 1999
- Number of Terminations :
- 8
- Output Characteristics :
- 3-STATE
- Standby Current-Max :
- 0.00005A
- Operating Temperature :
- 0°C~70°C
- ECCN Code :
- EAR99
- Base Part Number :
- XC17S30XL
- Supply Voltage-Min (Vsup) :
- 3V
- JESD-609 Code :
- e3
- Memory Size :
- 300kb
- Terminal Pitch :
- 1.27mm
- Programmable Type :
- OTP
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Peak Reflow Temperature (Cel) :
- 260
- Operating Supply Voltage :
- 3.3V
- Surface Mount :
- yes
- Terminal Finish :
- Matte Tin (Sn)
- Terminal Position :
- Dual
- Number of Pins :
- 8
- Mounting Type :
- Surface Mount
- Pin Count :
- 8
- Memory IC Type :
- MEMORY CIRCUIT
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Datasheets
- XC17S30XLVOG8C

[Configuration Proms for FPGAs AMD Xilinx XC17S30XLVOG8C] Overview
Introducing the cutting-edge Configuration Proms for FPGAs by AMD Xilinx, the XC17S30XLVOG8C. These integrated circuits represent the pinnacle of innovation in the field of programmable logic devices. Designed to meet the demanding requirements of modern electronics, these PROM serial devices offer unparalleled performance and reliability.
Featuring a robust 3.3V operation and a spacious 300K-bit capacity, the XC17S30XLVOG8C ensures seamless integration into diverse electronic systems. Its compact 8SOIC package facilitates effortless installation, making it ideal for applications where space is at a premium.
Engineered with precision and backed by AMD Xilinx's reputation for excellence, these Configuration Proms for FPGAs are poised to revolutionize the way electronic systems are configured and deployed.
[XC17S30XLVOG8C] Features
- Highly reliable PROM serial interface
- Operates at 3.3V, ensuring compatibility with various systems
- Spacious 300K-bit capacity for extensive configuration data storage
- Compact 8SOIC package for easy integration
- Robust construction for durability in harsh environments
- Designed and manufactured by AMD Xilinx, a trusted industry leader
[XC17S30XLVOG8C] Applications
- Field-Programmable Gate Arrays (FPGAs): The XC17S30XLVOG8C serves as an essential component in FPGA-based systems, enabling efficient configuration and reconfiguration of logic circuits. Its reliable PROM serial interface ensures seamless operation, making it indispensable in FPGA development and production.
- Embedded Systems: Incorporating the XC17S30XLVOG8C into embedded systems enhances their flexibility and adaptability. From industrial automation to consumer electronics, this device facilitates swift and reliable configuration updates, ensuring optimal performance in diverse applications.
- Telecommunication Infrastructure: In the telecommunications sector, the XC17S30XLVOG8C plays a crucial role in configuring network equipment and infrastructure. Its robust design and high-capacity storage make it well-suited for managing complex configurations in routers, switches, and other critical components of communication networks.
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