XC17S30XLVOG8C

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Mfr.Part #
XC17S30XLVOG8C
Manufacturer
AMD Xilinx
Package / Case
8-SOIC (0.154, 3.90mm Width)
Datasheet
Download
Description
IC PROM SERIAL 3.3V 300K 8-SOIC
Stock
20,205
In Stock :
20,205

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
Clock Frequency :
10MHz
Number of Functions :
1
I/O Type :
COMMON
Voltage - Supply :
3V~3.6V
Radiation Hardening :
No
Supply Current-Max :
0.005mA
Supply Voltage :
3.3V
RoHS Status :
RoHS Compliant
Width :
3.9mm
Supply Voltage-Max (Vsup) :
3.6V
Packaging :
Tray
Pbfree Code :
yes
Time@Peak Reflow Temperature-Max (s) :
30
Length :
4.9mm
Height Seated (Max) :
1.2mm
Terminal Form :
Gull wing
Memory Width :
1
Published :
1999
Number of Terminations :
8
Output Characteristics :
3-STATE
Standby Current-Max :
0.00005A
Operating Temperature :
0°C~70°C
ECCN Code :
EAR99
Base Part Number :
XC17S30XL
Supply Voltage-Min (Vsup) :
3V
JESD-609 Code :
e3
Memory Size :
300kb
Terminal Pitch :
1.27mm
Programmable Type :
OTP
Package / Case :
8-SOIC (0.154, 3.90mm Width)
Peak Reflow Temperature (Cel) :
260
Operating Supply Voltage :
3.3V
Surface Mount :
yes
Terminal Finish :
Matte Tin (Sn)
Terminal Position :
Dual
Number of Pins :
8
Mounting Type :
Surface Mount
Pin Count :
8
Memory IC Type :
MEMORY CIRCUIT
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Datasheets
XC17S30XLVOG8C
Introducing Configuration Proms for FPGAs AMD Xilinx XC17S30XLVOG8C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:8, Operating Temperature:0°C~70°C, Base Part Number:XC17S30XL, Package / Case:8-SOIC (0.154, 3.90mm Width), Number of Pins:8, Mounting Type:Surface Mount, XC17S30XLVOG8C pinout, XC17S30XLVOG8C datasheet PDF, XC17S30XLVOG8C amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC17S30XLVOG8C ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC17S30XLVOG8C


[Configuration Proms for FPGAs AMD Xilinx XC17S30XLVOG8C] Overview

Introducing the cutting-edge Configuration Proms for FPGAs by AMD Xilinx, the XC17S30XLVOG8C. These integrated circuits represent the pinnacle of innovation in the field of programmable logic devices. Designed to meet the demanding requirements of modern electronics, these PROM serial devices offer unparalleled performance and reliability.

Featuring a robust 3.3V operation and a spacious 300K-bit capacity, the XC17S30XLVOG8C ensures seamless integration into diverse electronic systems. Its compact 8SOIC package facilitates effortless installation, making it ideal for applications where space is at a premium.

Engineered with precision and backed by AMD Xilinx's reputation for excellence, these Configuration Proms for FPGAs are poised to revolutionize the way electronic systems are configured and deployed.

[XC17S30XLVOG8C] Features

  • Highly reliable PROM serial interface
  • Operates at 3.3V, ensuring compatibility with various systems
  • Spacious 300K-bit capacity for extensive configuration data storage
  • Compact 8SOIC package for easy integration
  • Robust construction for durability in harsh environments
  • Designed and manufactured by AMD Xilinx, a trusted industry leader

[XC17S30XLVOG8C] Applications

  • Field-Programmable Gate Arrays (FPGAs): The XC17S30XLVOG8C serves as an essential component in FPGA-based systems, enabling efficient configuration and reconfiguration of logic circuits. Its reliable PROM serial interface ensures seamless operation, making it indispensable in FPGA development and production.
  • Embedded Systems: Incorporating the XC17S30XLVOG8C into embedded systems enhances their flexibility and adaptability. From industrial automation to consumer electronics, this device facilitates swift and reliable configuration updates, ensuring optimal performance in diverse applications.
  • Telecommunication Infrastructure: In the telecommunications sector, the XC17S30XLVOG8C plays a crucial role in configuring network equipment and infrastructure. Its robust design and high-capacity storage make it well-suited for managing complex configurations in routers, switches, and other critical components of communication networks.
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