XC17S30ASO20C
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- Mfr.Part #
- XC17S30ASO20C
- Manufacturer
- AMD Xilinx
- Package / Case
- 20-SOIC (0.295, 7.50mm Width)
- Datasheet
- Download
- Description
- IC PROM SER 30000 C-TEMP 20-SOIC
- Stock
- 9,433
- In Stock ：
- 9,433
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Lead Free :
- Contains Lead
- Density :
- 512 kb
- Programmable Type :
- OTP
- Memory Size :
- 300kb
- HTS Code :
- 8542.32.00.71
- Organization :
- 336768X1
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Output Characteristics :
- 3-STATE
- Voltage - Supply :
- 3V~3.6V
- Length :
- 12.8mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Supply Voltage-Max (Vsup) :
- 3.6V
- Supply Current-Max :
- 0.005mA
- Operating Supply Voltage :
- 3.3V
- I/O Type :
- COMMON
- ECCN Code :
- EAR99
- Surface Mount :
- yes
- Supply Voltage :
- 3.3V
- JESD-609 Code :
- e0
- Published :
- 1999
- Radiation Hardening :
- No
- RoHS Status :
- Non-RoHS Compliant
- Number of Terminations :
- 20
- Operating Temperature :
- 0°C~70°C
- Memory IC Type :
- CONFIGURATION MEMORY
- Number of Pins :
- 20
- Pbfree Code :
- No
- Terminal Form :
- Gull wing
- Supply Voltage-Min (Vsup) :
- 3V
- Terminal Position :
- Dual
- Memory Width :
- 1
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Width :
- 7.5mm
- Base Part Number :
- XC17S30
- Mounting Type :
- Surface Mount
- Package / Case :
- 20-SOIC (0.295, 7.50mm Width)
- Number of Functions :
- 1
- Terminal Pitch :
- 1.27mm
- Pin Count :
- 20
- Packaging :
- Tube
- Peak Reflow Temperature (Cel) :
- 225
- Parallel/Serial :
- Serial
- Standby Current-Max :
- 0.00005A
- Height Seated (Max) :
- 2.65mm
- Datasheets
- XC17S30ASO20C
[Configuration Proms for FPGAs] Overview
Introducing the cutting-edge XC17S30ASO20C from AMD Xilinx, a leading name in integrated circuits technology. Designed to meet the demanding requirements of modern electronic systems, this IC PROM SER 30000 CTEMP 20SOIC is a powerful solution for configuration memory in Field-Programmable Gate Arrays (FPGAs). With its high performance and reliability, it stands as a testament to AMD Xilinx's commitment to excellence in semiconductor design.
Featuring advanced SER technology and a capacity of 30000, this PROM device ensures secure and efficient configuration storage, enabling seamless operation of FPGAs across various applications. Whether you're designing complex digital systems or implementing sophisticated algorithms, the XC17S30ASO20C delivers the performance and flexibility you need.
XC17S30ASO20C Features
- High-performance SER technology
- 30000 capacity for configuration storage
- 20SOIC package for easy integration
- Wide operating temperature range
- Robust reliability and data integrity
- Designed by AMD Xilinx, a trusted leader in semiconductor innovation
XC17S30ASO20C Applications
- Embedded Systems: The XC17S30ASO20C is ideal for configuring FPGAs in embedded systems, ensuring seamless integration and reliable operation in applications such as industrial automation and automotive electronics.
- Communications Infrastructure: In telecommunications and networking equipment, this PROM device plays a critical role in storing configuration data for FPGAs, enabling high-speed data processing and efficient network management.
- Consumer Electronics: From smart TVs to gaming consoles, the XC17S30ASO20C enhances the performance and functionality of consumer electronics by providing secure and fast configuration storage for FPGAs, enabling immersive user experiences.
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