XC17S30APD8C

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Mfr.Part #
XC17S30APD8C
Manufacturer
AMD Xilinx
Package / Case
8-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC PROM SER 30000 C-TEMP 8-DIP
Stock
1,428
In Stock :
1,428

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
Peak Reflow Temperature (Cel) :
225
Programmable Type :
OTP
JESD-609 Code :
e0
RoHS Status :
Non-RoHS Compliant
Parallel/Serial :
Serial
Memory Width :
1
Terminal Pitch :
2.54mm
Density :
512 kb
Package / Case :
8-DIP (0.300, 7.62mm)
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
I/O Type :
COMMON
Lead Free :
Contains Lead
Operating Temperature :
0°C~70°C
Number of Functions :
1
Memory IC Type :
CONFIGURATION MEMORY
Number of Pins :
8
Radiation Hardening :
No
Supply Voltage-Min (Vsup) :
3V
Pin Count :
8
Height Seated (Max) :
4.5974mm
Memory Size :
300kb
Standby Current-Max :
0.00005A
Output Characteristics :
3-STATE
Surface Mount :
No
Packaging :
Tube
Pbfree Code :
No
ECCN Code :
EAR99
Operating Supply Voltage :
3.3V
Voltage - Supply :
3V~3.6V
Width :
7.62mm
Published :
1999
Length :
9.3599mm
Supply Current-Max :
0.005mA
Base Part Number :
XC17S30
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Position :
Dual
Mounting Type :
Through Hole
Number of Terminations :
8
Supply Voltage :
3.3V
Supply Voltage-Max (Vsup) :
3.6V
Datasheets
XC17S30APD8C
Introducing Configuration Proms for FPGAs AMD Xilinx XC17S30APD8C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:8-DIP (0.300, 7.62mm), Operating Temperature:0°C~70°C, Number of Pins:8, Base Part Number:XC17S30, Mounting Type:Through Hole, Number of Terminations:8, XC17S30APD8C pinout, XC17S30APD8C datasheet PDF, XC17S30APD8C amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC17S30APD8C ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC17S30APD8C


[Configuration Proms for FPGAs] Overview

Introducing the cutting-edge XC17S30APD8C by AMD Xilinx, a leading-edge Integrated Circuits solution designed to revolutionize your FPGA configuration needs. This IC PROM SER 30000 CTEMP 8DIP is meticulously crafted to deliver unparalleled performance and reliability in even the most demanding environments.

With its advanced features and robust construction, this product is engineered to meet the stringent requirements of modern industrial applications. Whether you're in the aerospace, automotive, telecommunications, or industrial automation sector, this versatile solution is poised to enhance your operational efficiency and drive innovation.

Experience seamless integration, superior functionality, and unparalleled durability with the XC17S30APD8C, your ultimate choice for FPGA configuration PROMs.

XC17S30APD8C Features

  • High-quality IC PROM SER 30000 CTEMP 8DIP
  • Precision-engineered by AMD Xilinx for exceptional performance
  • Designed to meet industry standards for reliability and durability
  • Wide operating temperature range for versatility in various environments
  • Compact 8DIP package for easy integration into existing systems
  • Efficient serial configuration interface for seamless operation
  • Robust construction for long-term reliability in demanding applications

XC17S30APD8C Applications

  • Industrial Automation: Employed in programmable logic controllers (PLCs) for configuring FPGAs in manufacturing processes, ensuring smooth operation and precise control.
  • Aerospace: Integrated into avionics systems for configuring FPGAs in flight control systems, enabling reliable performance and safety in aerospace applications.
  • Telecommunications: Utilized in network infrastructure equipment for configuring FPGAs in routers and switches, facilitating high-speed data processing and efficient network management.
  • Automotive: Incorporated into automotive electronics for configuring FPGAs in advanced driver assistance systems (ADAS), enhancing vehicle safety and performance.
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