XC17S30APD8C

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Mfr.Part #
XC17S30APD8C
Manufacturer
AMD Xilinx
Package / Case
8-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC PROM SER 30000 C-TEMP 8-DIP
Stock
1,428
In Stock :
1,428

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
Number of Terminations :
8
Terminal Position :
Dual
Radiation Hardening :
No
Supply Voltage-Max (Vsup) :
3.6V
Peak Reflow Temperature (Cel) :
225
RoHS Status :
Non-RoHS Compliant
Package / Case :
8-DIP (0.300, 7.62mm)
Height Seated (Max) :
4.5974mm
Packaging :
Tube
Surface Mount :
No
Number of Functions :
1
Length :
9.3599mm
Pin Count :
8
Memory Size :
300kb
Operating Supply Voltage :
3.3V
Operating Temperature :
0°C~70°C
Time@Peak Reflow Temperature-Max (s) :
30
Standby Current-Max :
0.00005A
Mounting Type :
Through Hole
Published :
1999
Memory IC Type :
CONFIGURATION MEMORY
Supply Voltage-Min (Vsup) :
3V
Parallel/Serial :
Serial
Base Part Number :
XC17S30
JESD-609 Code :
e0
Memory Width :
1
Voltage - Supply :
3V~3.6V
Width :
7.62mm
I/O Type :
COMMON
Output Characteristics :
3-STATE
Lead Free :
Contains Lead
Supply Voltage :
3.3V
Terminal Pitch :
2.54mm
ECCN Code :
EAR99
Number of Pins :
8
Pbfree Code :
No
Supply Current-Max :
0.005mA
Density :
512 kb
Programmable Type :
OTP
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Datasheets
XC17S30APD8C
Introducing Configuration Proms for FPGAs AMD Xilinx XC17S30APD8C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:8, Package / Case:8-DIP (0.300, 7.62mm), Operating Temperature:0°C~70°C, Mounting Type:Through Hole, Base Part Number:XC17S30, Number of Pins:8, XC17S30APD8C pinout, XC17S30APD8C datasheet PDF, XC17S30APD8C amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC17S30APD8C ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC17S30APD8C


[Configuration Proms for FPGAs] Overview

Introducing the cutting-edge XC17S30APD8C by AMD Xilinx, a leading-edge Integrated Circuits solution designed to revolutionize your FPGA configuration needs. This IC PROM SER 30000 CTEMP 8DIP is meticulously crafted to deliver unparalleled performance and reliability in even the most demanding environments.

With its advanced features and robust construction, this product is engineered to meet the stringent requirements of modern industrial applications. Whether you're in the aerospace, automotive, telecommunications, or industrial automation sector, this versatile solution is poised to enhance your operational efficiency and drive innovation.

Experience seamless integration, superior functionality, and unparalleled durability with the XC17S30APD8C, your ultimate choice for FPGA configuration PROMs.

XC17S30APD8C Features

  • High-quality IC PROM SER 30000 CTEMP 8DIP
  • Precision-engineered by AMD Xilinx for exceptional performance
  • Designed to meet industry standards for reliability and durability
  • Wide operating temperature range for versatility in various environments
  • Compact 8DIP package for easy integration into existing systems
  • Efficient serial configuration interface for seamless operation
  • Robust construction for long-term reliability in demanding applications

XC17S30APD8C Applications

  • Industrial Automation: Employed in programmable logic controllers (PLCs) for configuring FPGAs in manufacturing processes, ensuring smooth operation and precise control.
  • Aerospace: Integrated into avionics systems for configuring FPGAs in flight control systems, enabling reliable performance and safety in aerospace applications.
  • Telecommunications: Utilized in network infrastructure equipment for configuring FPGAs in routers and switches, facilitating high-speed data processing and efficient network management.
  • Automotive: Incorporated into automotive electronics for configuring FPGAs in advanced driver assistance systems (ADAS), enhancing vehicle safety and performance.
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Shipping Cost

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