XC17S15ASO20C
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- Mfr.Part #
- XC17S15ASO20C
- Manufacturer
- AMD Xilinx
- Package / Case
- 20-SOIC (0.295, 7.50mm Width)
- Datasheet
- Download
- Description
- IC PROM SER 5000 C-TEMP 20-SOIC
- Stock
- 38,564
- In Stock ：
- 38,564
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Width :
- 7.5mm
- Terminal Pitch :
- 1.27mm
- Pin Count :
- 20
- Lead Free :
- Contains Lead
- ECCN Code :
- EAR99
- Standby Current-Max :
- 0.00005A
- Terminal Form :
- Gull wing
- RoHS Status :
- Non-RoHS Compliant
- Height Seated (Max) :
- 2.65mm
- Mounting Type :
- Surface Mount
- Published :
- 1999
- Operating Supply Voltage :
- 3.3V
- Supply Current-Max :
- 0.005mA
- Pbfree Code :
- No
- Supply Voltage :
- 3.3V
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Parallel/Serial :
- Serial
- Voltage - Supply :
- 3V~3.6V
- Package / Case :
- 20-SOIC (0.295, 7.50mm Width)
- Surface Mount :
- yes
- Density :
- 512 kb
- Memory IC Type :
- CONFIGURATION MEMORY
- I/O Type :
- COMMON
- Radiation Hardening :
- No
- Memory Size :
- 150kb
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Peak Reflow Temperature (Cel) :
- 225
- Number of Terminations :
- 20
- Memory Width :
- 1
- HTS Code :
- 8542.32.00.71
- Programmable Type :
- OTP
- Packaging :
- Tube
- Organization :
- 197696X1
- Supply Voltage-Max (Vsup) :
- 3.6V
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Supply Voltage-Min (Vsup) :
- 3V
- Output Characteristics :
- 3-STATE
- Terminal Position :
- Dual
- Operating Temperature :
- 0°C~70°C
- Length :
- 12.8mm
- Base Part Number :
- XC17S15A
- Number of Pins :
- 20
- Number of Functions :
- 1
- JESD-609 Code :
- e0
- Datasheets
- XC17S15ASO20C
[Configuration Proms for FPGAs - AMD Xilinx XC17S15ASO20C] Overview
Experience the pinnacle of reliability and performance with the XC17S15ASO20C Configuration Proms from AMD Xilinx. Designed to meet the exacting demands of modern integrated circuit design, these PROMs offer unparalleled versatility and precision.
Engineered to deliver seamless integration within FPGA architectures, the XC17S15ASO20C ensures swift and accurate configuration, even in the most challenging environments. With a temperature range of -40°C to +85°C, these PROMs guarantee steadfast operation across a wide spectrum of applications.
Trust in AMD Xilinx's legacy of innovation and excellence, and elevate your designs to new heights with the XC17S15ASO20C Configuration Proms.
XC17S15ASO20C Features
- High-performance PROMs tailored for FPGA configuration
- Robust construction for reliability in harsh environments
- Wide temperature range (-40°C to +85°C) for versatile application
- Industry-leading precision and accuracy
- Efficient integration within FPGA architectures
- Compact 20SOIC package for space-constrained designs
XC17S15ASO20C Applications
- Industrial Automation: Employed in programmable logic controllers (PLCs) for rapid and dependable configuration updates, ensuring seamless operation in factory automation systems.
- Telecommunications Infrastructure: Utilized in network switches and routers for efficient FPGA reconfiguration, enabling dynamic adaptation to evolving network demands and protocols.
- Automotive Electronics: Integrated into vehicle control units (VCUs) to facilitate real-time configuration adjustments, enhancing the performance and safety features of modern automobiles.
- Medical Devices: Incorporated within medical imaging equipment for on-the-fly FPGA reprogramming, allowing for customized image processing algorithms and improved diagnostic accuracy.
- Aerospace Systems: Deployed in avionics systems for rapid configuration updates in flight-critical applications, ensuring mission success and reliability in aerospace missions.
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