XC17S15APD8C

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Mfr.Part #
XC17S15APD8C
Manufacturer
AMD Xilinx
Package / Case
8-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC PROM SER 5000 C-TEMP 8-DIP
Stock
8,800
In Stock :
8,800

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
Packaging :
Tube
Mounting Type :
Through Hole
Parallel/Serial :
Serial
Memory Size :
150kb
Package / Case :
8-DIP (0.300, 7.62mm)
Terminal Pitch :
2.54mm
Supply Current-Max :
0.005mA
Output Characteristics :
3-STATE
Pin Count :
8
Memory Width :
1
Height Seated (Max) :
4.5974mm
Time@Peak Reflow Temperature-Max (s) :
30
Length :
9.3599mm
Peak Reflow Temperature (Cel) :
225
Standby Current-Max :
0.00005A
Published :
1999
Surface Mount :
No
Density :
512 kb
ECCN Code :
EAR99
Number of Functions :
1
Terminal Position :
Dual
Supply Voltage :
3.3V
Moisture Sensitivity Level (MSL) :
Not Applicable
Voltage - Supply :
3V~3.6V
Organization :
197696X1
Memory IC Type :
CONFIGURATION MEMORY
Lead Free :
Contains Lead
Number of Terminations :
8
Operating Temperature :
0°C~70°C
Width :
7.62mm
Radiation Hardening :
No
JESD-609 Code :
e0
Pbfree Code :
No
Programmable Type :
OTP
I/O Type :
COMMON
Supply Voltage-Max (Vsup) :
3.6V
Number of Pins :
8
Operating Supply Voltage :
3.3V
Base Part Number :
XC17S15A
Supply Voltage-Min (Vsup) :
3V
RoHS Status :
Non-RoHS Compliant
Datasheets
XC17S15APD8C
Introducing Configuration Proms for FPGAs AMD Xilinx XC17S15APD8C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Package / Case:8-DIP (0.300, 7.62mm), Number of Terminations:8, Operating Temperature:0°C~70°C, Number of Pins:8, Base Part Number:XC17S15A, XC17S15APD8C pinout, XC17S15APD8C datasheet PDF, XC17S15APD8C amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC17S15APD8C ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC17S15APD8C


[Configuration Proms for FPGAs AMD Xilinx XC17S15APD8C] Overview

Introducing the cutting-edge Configuration Proms for FPGAs by AMD Xilinx, the XC17S15APD8C. Designed to meet the demanding requirements of modern electronic systems, these integrated circuits (ICs) redefine versatility and reliability in programmable logic devices.

Boasting a robust construction and advanced technology, the XC17S15APD8C serves as the cornerstone for seamless integration within various electronic applications. Whether you're delving into telecommunications, industrial automation, or aerospace, this high-performance IC promises unparalleled performance and adaptability.

Explore a world of limitless possibilities with AMD Xilinx's XC17S15APD8C, where innovation meets excellence.

[XC17S15APD8C] Features

  • Highly reliable PROM technology
  • 5000-cycle endurance for extended usage
  • Wide operating temperature range (-40°C to +85°C)
  • Compact 8DIP package for space-efficient designs
  • Low power consumption for energy-efficient operation

[XC17S15APD8C] Applications

  • Telecommunications: Utilized in base stations and network infrastructure for FPGA configuration, ensuring seamless data transmission and reception.
  • Industrial Automation: Integrated into PLCs (Programmable Logic Controllers) to facilitate real-time control and monitoring of manufacturing processes in diverse industrial settings.
  • Aerospace: Employed in avionics systems for FPGA configuration, enabling enhanced performance and reliability in critical flight operations.
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