XC17S10XLVO8C
- Mfr.Part #
- XC17S10XLVO8C
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- IC 3V PROM SER 10K 8-SOIC
- Stock
- 40,017
- In Stock :
- 40,017
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Width :
- 3.9mm
- Clock Frequency :
- 10MHz
- Memory Density :
- 95752 bit
- Terminal Position :
- Dual
- Standby Current-Max :
- 0.00005A
- Packaging :
- Tube
- Number of Pins :
- 8
- Length :
- 4.9mm
- I/O Type :
- COMMON
- Terminal Pitch :
- 1.27mm
- Organization :
- 95752X1
- Programmable Type :
- OTP
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Supply Voltage-Max (Vsup) :
- 3.6V
- Memory Size :
- 100kB
- Voltage - Supply :
- 3V~3.6V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Supply Voltage-Min (Vsup) :
- 3V
- Terminal Form :
- Gull wing
- Operating Mode :
- SYNCHRONOUS
- Peak Reflow Temperature (Cel) :
- 225
- Qualification Status :
- Not Qualified
- Pbfree Code :
- No
- Lead Free :
- Contains Lead
- Supply Current-Max :
- 0.005mA
- Memory IC Type :
- MEMORY CIRCUIT
- JESD-609 Code :
- e0
- Published :
- 1999
- Memory Width :
- 1
- Surface Mount :
- yes
- Number of Functions :
- 1
- ECCN Code :
- EAR99
- Power Supplies :
- 3.3V
- Height Seated (Max) :
- 1.2mm
- Operating Temperature :
- 0°C~70°C
- Number of Terminations :
- 8
- RoHS Status :
- Non-RoHS Compliant
- Mounting Type :
- Surface Mount
- Base Part Number :
- XC17S10XL
- Pin Count :
- 8
- Reach Compliance Code :
- not_compliant
- Output Characteristics :
- 3-STATE
- Supply Voltage :
- 3.3V
- Datasheets
- XC17S10XLVO8C

[Configuration Proms for FPGAs] Overview
Welcome to the forefront of semiconductor innovation with AMD Xilinx's XC17S10XLVO8C, a cutting-edge Integrated Circuit (IC) designed to revolutionize the field of Field-Programmable Gate Arrays (FPGAs). This 3V PROM SER 10K 8SOIC device represents a pinnacle in programmable logic technology, offering unparalleled flexibility and efficiency in configuration management for FPGA systems.
With its compact 8SOIC form factor and robust 3V operation, the XC17S10XLVO8C empowers engineers and developers to optimize their FPGA deployments with ease. Whether you're a seasoned professional or a budding enthusiast, this IC delivers the performance and reliability you need to bring your FPGA projects to life.
Experience the future of FPGA configuration management – experience the XC17S10XLVO8C.
XC17S10XLVO8C Features
- Advanced 3V PROM technology for reliable configuration storage
- Serious 10K endurance for enduring performance in demanding environments
- Compact 8SOIC package for seamless integration into FPGA designs
- Efficient serial interface for fast and hassle-free configuration updates
- Robust design for dependable operation in industrial applications
XC17S10XLVO8C Applications
- Field-Programmable Gate Array (FPGA) Configuration Management: The XC17S10XLVO8C is ideally suited for storing and managing configuration data in FPGA-based systems. Its high endurance and reliable performance make it the perfect choice for ensuring smooth operation and seamless updates in FPGA deployments across various industries.
- Embedded Systems: Integrate the XC17S10XLVO8C into embedded systems requiring flexible configuration options. From industrial automation to telecommunications, this IC offers the versatility and reliability needed to meet the demands of modern embedded applications.
- Communications Infrastructure: Enhance the performance and reliability of communication infrastructure with the XC17S10XLVO8C. Whether used in network switches, routers, or wireless base stations, this IC provides efficient configuration management to ensure optimal network operation and seamless scalability.
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