W25N01GWTBIG TR

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Cell Type :

NAND

Minimum Operating Supply Voltage (V) :

1.7

Maximum Programming Time (ms) :

0.7/Page

Page Size :

2Kbyte

Supplier Temperature Grade :

Industrial

Address Bus Width (bit) :

32

Typical Operating Supply Voltage (V) :

1.8

Maximum Operating Temperature (°C) :

85

Chip Density (bit) :

1G

Timing Type :

SYNCHRONOUS

Maximum Operating Supply Voltage (V) :

1.95

Number of Bits/Word (bit) :

8

Operating Current (mA) :

35

Block Organization :

Symmetrical

Programming Voltage (V) :

1.7 to 1.95

Mounting :

Surface Mount

Supplier Package :

TFBGA

Command Compatible :

yes

Max. Access Time (ns) :

8

Program Current (mA) :

35

PPAP :

No

Architecture :

Sectored

Interface Type :

Serial (SPI, Dual SPI, Quad SPI)

Support of Page Mode :

No

Package Height :

0.85

Minimum Operating Temperature (°C) :

-40

Programmability :

yes

PCB changed :

24

Boot Block :

No

Package Length :

8

Sector Size :

128Kbyte x 1024

Maximum Erase Time (S) :

0.01/Block

Pin Count :

24

Packaging :

Tray

Number of Words :

128M

ECC Support :

yes

ECCN (US) :

3A991.B.1.A

Minimum Endurance (Cycles) :

100000

EU RoHS :

Compliant

Package Width :

6

Automotive :

No