W25N01GVSFIG

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Number of Functions :

1

Terminal Pitch :

1.27 mm

Mounting Style :

SMD/SMT

Product Type :

NAND Flash

Supply Voltage-Min (Vsup) :

2.7 V

Supply Voltage-Max (Vsup) :

3.6 V

Package Shape :

RECTANGULAR

Memory IC Type :

Flash

Memory Organization :

128M x 8

Data Bus Width :

8 bit

Manufacturer :

Winbond

Write Cycle Time - Word, Page :

700µs

Memory Interface :

SPI - Quad I/O

Type :

QspiNAND Flash

Organization :

High Quality Single Level Cell (SLC) Technology Standard Serial Interface with x1/x2/x4 Bus Width

JESD-30 Code :

R-PDSO-G16

Temperature :

-40ºC ~ 85ºC / -40ºC ~ 105ºC

Package / Case :

SOIC-16

Product Status :

Active

Minimum Operating Temperature :

- 40 C

Length :

10.31 mm

Temperature Grade :

Industrial

Package :

Tray

Supplier Device Package :

16-SOIC

Seated Height-Max :

2.64 mm

Voltage - Supply :

2.7V ~ 3.6V

Operating Temperature :

-40°C ~ 85°C (TA)

Terminal Position :

Dual

RoHS :

Details

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Timing Type :

ASYNCHRONOUS

Product Category :

NAND Flash

Subcategory :

Memory and Data Storage

Memory Density :

1GB

Brand :

Winbond

Memory Width :

8

Memory Format :

Flash

Surface Mount :

yes

Programming Voltage :

3 V

Speed :

104MHz

Clock Frequency :

104 MHz

Memory Type :

Non-Volatile

Maximum Operating Temperature :

+ 85 C

Access Time :

7 ns

Reach Compliance Code :

Compliant

Interface Type :

SPI

Series :

W25N01GV

Parallel/Serial :

Serial

Technology :

FLASH - NAND (SLC)

Mounting Type :

Surface Mount

Base Product Number :

W25N01

Terminal Form :

Gull wing

Width :

7.49 mm

Memory Size :

1 Gbit

Operating Mode :

SYNCHRONOUS

Tradename :

SpiFlash

Number of Words :

134217728 words

Number of Terminals :

16