TSM-110-03-G-DV

Manufacturer :

Samtec, Inc.

Product Category :

Headers, Male Pins

Pitch - Mating :

0.100 2.54mm

Body Depth :

0.15 inch

Contact Finish - Mating :

Gold

Insulation Material :

Liquid Crystal Polymer (LCP)

Insulation Height :

0.100 2.54mm

Fastening Type :

Push-Pull

MIL Conformance :

No

PCB Contact Pattern :

RECTANGULAR

PCB Contact Row Spacing :

4.953 mm

Contact Shape :

Square

Total Number of Contacts :

20

Mixed Contacts :

No

Mounting Type :

Surface Mount

Filter Feature :

No

DIN Conformance :

No

Contact Material :

Phosphor Bronze

Pbfree Code :

yes

Body Length or Diameter :

1 inch

Number Of PCB Rows :

2

Contact Finish Thickness - Mating :

10.0μin 0.25μm

Contact Length - Mating :

0.420 10.67mm

Series :

TSM

Board Mounting Option :

PEG

Mating Contact Pitch :

0.1 inch

Reliability :

COMMERCIAL

Insulation Color :

Black

Reach Compliance Code :

not_compliant

Material Flammability Rating :

UL94 V-0

Plating Thickness :

10μin

Feature :

Board Guide

Row Spacing - Mating :

0.100 (2.54mm)

Contact Finish Thickness - Post :

3.00μin 0.076μm

Factory Lead Time :

3 Weeks

Number of Positions Loaded :

All

IEC Conformance :

No

Termination :

Solder

JESD-609 Code :

e4

Connector Type :

Header

Number of Conductors :

ONE

Contact Type :

Male Pin

Operating Temperature :

-55°C~125°C

RoHS Status :

ROHS3 Compliant

Option :

GENERAL PURPOSE

Shrouding :

Unshrouded

Number of Positions :

20

Number of Rows :

2

Style :

Board to Board or Cable

Packaging :

Tube