SPC5777CDK3MME3

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Peak Reflow Temperature (Cel) :

260

Terminal Pitch :

1mm

Number of Terminations :

416

RAM Size :

512K x 8

Data Converter :

A/D 16b Sigma-Delta, eQADC

DMA Channels :

yes

Has ADC :

yes

Series :

MPC57xx

Packaging :

Tray

Time@Peak Reflow Temperature-Max (s) :

40

Mounting Type :

Surface Mount

Voltage - Supply (Vcc/Vdd) :

3V~5.5V

Operating Temperature :

-40°C~125°C TA

ROM (words) :

8388608

Additional Feature :

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

JESD-30 Code :

S-PBGA-B416

RoHS Status :

ROHS3 Compliant

Package / Case :

416-BGA

Clock Frequency :

40MHz

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Surface Mount :

yes

Connectivity :

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

Supply Voltage-Min (Vsup) :

1.2V

PWM Channels :

yes

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Core Size :

32-Bit Tri-Core

Oscillator Type :

Internal

Terminal Position :

BOTTOM

Bit Size :

32

Program Memory Type :

Flash

Length :

27mm

Terminal Form :

Ball

On Chip Program ROM Width :

8

Supply Voltage-Max (Vsup) :

1.32V

Core Processor :

e200z7

RAM (bytes) :

524288

DAC Channels :

No

Height Seated (Max) :

2.02mm

Peripherals :

DMA, LVD, POR, Zipwire

Program Memory Size :

8MB 8M x 8

Width :

27mm

Factory Lead Time :

16 Weeks

Speed :

264MHz