R5F563NBCDBG#U0

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Mfr.Part #
R5F563NBCDBG#U0
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
176-LFBGA
Datasheet
Download
Description
IC MCU 32BIT 1MB FLASH 176LFBGA
Stock
6,289
In Stock :
6,289

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Microcontrollers
Base Part Number :
R5F563NB
Mounting Type :
Surface Mount
Lead Free :
Lead Free
Supply Current-Max :
100mA
Qualification Status :
Not Qualified
Operating Supply Voltage :
3.6V
Series :
RX600
DAC Channels :
yes
EEPROM Size :
32K x 8
Terminal Form :
Ball
RAM Size :
128K x 8
Packaging :
Tray
Factory Lead Time :
20 Weeks
Pin Count :
176
Interface :
CAN, EBI/EMI, Ethernet, I2C, LIN, SCI, SPI, USB
Core Size :
32-Bit
Connectivity :
I²C, UART/USART
Voltage - Supply (Vcc/Vdd) :
2.7V~3.6V
Number of Terminations :
176
External Data Bus Width :
32
Length :
13mm
Memory Size :
1Mb
Width :
13mm
Terminal Position :
BOTTOM
Core Processor :
RX
Terminal Pitch :
0.8mm
Package / Case :
176-LFBGA
Power Supplies :
3/3.3V
Bit Size :
32
Number of I/O :
133
ROM (words) :
1048576
Data Converter :
A/D 8x10b, 21x12b; D/A 2x10b
Peripherals :
DMA, LVD, POR, PWM, WDT
Frequency :
100MHz
Published :
2013
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
DMA Channels :
yes
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
HTS Code :
8542.31.00.01
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Program Memory Size :
1MB 1M x 8
Number of Pins :
176
Oscillator Type :
Internal
Operating Temperature :
-40°C~85°C TA
Supply Voltage :
3V
RoHS Status :
ROHS3 Compliant
On Chip Program ROM Width :
8
Pbfree Code :
yes
CPU Family :
RX
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Has ADC :
yes
Height Seated (Max) :
1.4mm
PWM Channels :
yes
Program Memory Type :
Flash
Address Bus Width :
24
Surface Mount :
yes
Datasheets
R5F563NBCDBG#U0
Introducing Microcontrollers Intersil (Renesas Electronics Corporation) R5F563NBCDBG#U0 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:R5F563NB, Mounting Type:Surface Mount, Number of Terminations:176, Package / Case:176-LFBGA, Number of Pins:176, Operating Temperature:-40°C~85°C TA, R5F563NBCDBG#U0 pinout, R5F563NBCDBG#U0 datasheet PDF, R5F563NBCDBG#U0 amp .Beyond Microcontrollers Intersil (Renesas Electronics Corporation) R5F563NBCDBG#U0 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) R5F563NBCDBG#U0


Microcontrollers Intersil (Renesas Electronics Corporation) R5F563NBCDBG#U0 Overview

Introducing the Microcontrollers Intersil (Renesas Electronics Corporation) R5F563NBCDBG#U0, a robust 32-bit microcontroller unit (MCU) designed to cater to sophisticated embedded applications. With its 1MB of integrated flash memory and housed in a 176LFBGA package, this MCU is engineered for performance and versatility. Manufactured by Renesas Electronics, a leader in semiconductor solutions, the R5F563NBCDBG#U0 is tailored to enhance the efficiency and reliability of advanced electronics systems. Its significant memory capacity and flexible package design make it an ideal choice for developers looking for scalable and high-performance microcontroller solutions.

R5F563NBCDBG#U0 Features

This high-performance MCU features a 32-bit processing core, providing efficient handling of complex algorithms and processes. With 1MB of flash memory, it supports extensive program storage and swift data access. The 176LFBGA package ensures compact integration into a wide array of applications, from consumer electronics to industrial automation systems. Additional features include low power consumption, enhanced security protocols, and extensive interface support, making it a versatile and secure choice for demanding applications.

R5F563NBCDBG#U0 Applications

  • Automotive Systems: Utilized in engine management and infotainment systems, enhancing performance and reliability.
  • Industrial Automation: Drives automation in manufacturing processes, contributing to increased productivity and safety.
  • Consumer Electronics: Powers complex consumer electronics, such as smart home devices and portable electronics, offering robust operation and connectivity.
  • Medical Devices: Deployed in medical monitoring systems, improving the accuracy and reliability of health monitoring solutions.
  • Communication Equipment: Essential in communication infrastructures, ensuring efficient and stable operation.
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