PIC32MX170F512H-50I/MR

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Mfr.Part #
PIC32MX170F512H-50I/MR
Manufacturer
Microchip Technology
Package / Case
64-VFQFN Exposed Pad
Datasheet
Download
Description
IC MCU 32BIT 512KB FLASH 64QFN
Stock
49,160
In Stock :
49,160

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Core Size :
32-Bit
Supplier Device Package :
64-QFN (9x9)
JESD-609 Code :
e3
Supply Voltage-Min (Vsup) :
2.3V
RAM Size :
64K x 8
Base Product Number :
PIC32MX170
Device Core :
PIC
Surface Mount :
yes
DMA Channels :
yes
PWM Channels :
yes
DAC Channels :
No
Product Type :
32-bit Microcontrollers - MCU
Terminal Position :
QUAD
Product Category :
32-bit Microcontrollers - MCU
Oscillator Type :
Internal
Package / Case :
64-VFQFN Exposed Pad
Data Bus Width :
32b
Watchdog Timer :
yes
Tradename :
MIPS32
Data Converter :
A/D 28x10b
Length :
9mm
Supply Voltage-Max (Vsup) :
3.6V
Data Converters :
A/D 28x10b
Speed :
50MHz
Core Architecture :
PIC
Product Status :
Active
Number of Timers/Counters :
5
Frequency :
50MHz
EEPROM Size :
--
Program Memory Size :
512KB 512K x 8
Memory Size :
512kB
Manufacturer :
Microchip
RoHS :
Details
Address Bus Width :
16
Core Processor :
MIPS32® M4K™
RoHS Status :
ROHS3 Compliant
On Chip Program ROM Width :
8
Has ADC :
yes
Brand :
Microchip Technology
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply (Vcc/Vdd) :
2.3V~3.6V
Terminal Finish :
Matte Tin (Sn) - annealed
Packaging :
Tube
Interface :
I2C, I2S, IrDA, LIN, SPI, UART, USART
Screening Level :
TS 16949
Height Seated (Max) :
1mm
Supply Voltage :
3.3V
Subcategory :
Microcontrollers - MCU
Factory Lead Time :
6 Weeks
Operating Temperature :
-40°C~85°C TA
Base Part Number :
PIC32MX170F512H
JESD-30 Code :
S-PQCC-N64
Bit Size :
32
Number of I/O :
53
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Package :
Tube
Mounting Type :
Surface Mount
Interfaces :
I2C/I2S/SPI/UART
Radiation Hardening :
No
Program Memory Type :
Flash
Number of Terminations :
64
Series :
PIC® 32MX
Peripherals :
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Published :
2016
Introducing Microcontrollers Microchip Technology PIC32MX170F512H-50I/MR from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:64-VFQFN Exposed Pad, Operating Temperature:-40°C~85°C TA, Base Part Number:PIC32MX170F512H, Mounting Type:Surface Mount, Number of Terminations:64, PIC32MX170F512H-50I/MR pinout, PIC32MX170F512H-50I/MR datasheet PDF, PIC32MX170F512H-50I/MR amp .Beyond Microcontrollers Microchip Technology PIC32MX170F512H-50I/MR ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology PIC32MX170F512H-50I/MR


Microcontrollers Microchip Technology PIC32MX170F512H-50I/MR Overview

The PIC32MX170F512H-50I/MR from Microchip Technology is a high-performance microcontroller (MCU) designed to meet the rigorous demands of modern embedded systems. This 32-bit MCU is built around Microchip's powerful MIPS M4K core and is equipped with 512KB of Flash memory, providing ample space for application code and data storage. With its robust feature set and impressive processing capabilities, the Microcontrollers Microchip Technology PIC32MX170F512H-50I/MR is ideal for advanced applications that require efficient data management and high-speed processing.

PIC32MX170F512H-50I/MR Features

  • 32-bit MIPS M4K Core
  • 512KB Flash Memory
  • Up to 50 MHz Clock Speed
  • 64-pin QFN Package
  • Low-power management features
  • Extensive digital interface support

PIC32MX170F512H-50I/MR Applications

  • Consumer Electronics: Ideal for powering advanced user interfaces, audio processing, and connected IoT devices, where its high-speed processing can enhance responsiveness and functionality.
  • Industrial Automation: Used in control systems requiring real-time processing and connectivity to manage complex operations and data analysis.
  • Medical Devices: Suitable for medical monitoring systems where its reliability and processing power ensure accurate real-time sensing and data logging.
  • Automotive Applications: Employed in vehicle telematics to provide reliable processing for in-car entertainment systems, navigation, and safety features.
  • Communication Systems: Forms the backbone of networked communication devices that require robust data handling capabilities and high-speed interfacing.
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