PIC18LF25K50-E/SP

Manufacturer :

Microchip Technology

Product Category :

Microcontrollers

Terminal Pitch :

2.54mm

Time@Peak Reflow Temperature-Max (s) :

Not Applicable

Series :

PIC® XLP™ 18K

Length :

34.671mm

DMA Channels :

No

Core Processor :

PIC

Package :

Tube

Terminal Finish :

MATTE TIN

Packaging :

Tube

JESD-609 Code :

e3

Supply Voltage-Min (Vsup) :

2.7V

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

Data Converter :

A/D 14x10b

Speed :

48MHz

Number of Terminations :

28

EEPROM Size :

256 x 8

Supplier Device Package :

28-SPDIP

Bit Size :

8

Oscillator Type :

Internal

JESD-30 Code :

R-PDIP-T28

Voltage - Supply (Vcc/Vdd) :

1.8V~3.6V

Height Seated (Max) :

5.08mm

Connectivity :

I2C, SPI, UART/USART, USB

Number of I/O :

25

DAC Channels :

yes

Width :

7.62mm

Supply Voltage-Max (Vsup) :

3.6V

Terminal Position :

Dual

Frequency :

48MHz

ECCN Code :

3A001.A.3

Interface :

I2C, SPI, UART, USART, USB

Has ADC :

yes

RAM Size :

2K x 8

Product Status :

Active

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Data Converters :

A/D 14x10b

Peripherals :

Brown-out Detect/Reset, POR, PWM, WDT

Package / Case :

28-DIP (0.300, 7.62mm)

ROM (words) :

16384

RoHS Status :

ROHS3 Compliant

Peak Reflow Temperature (Cel) :

Not Applicable

Additional Feature :

IT ALSO OPERATES IN 4MHZ AT 1.8V MIN SUPPLY

Core Size :

8-Bit

Program Memory Type :

Flash

Supply Voltage :

3V

Program Memory Size :

32KB 16K x 16

Base Part Number :

PIC18LF25K50

Surface Mount :

No

Operating Temperature :

-40°C~125°C TA

Base Product Number :

PIC18LF25

PWM Channels :

yes

HTS Code :

8542.31.00.01

Mounting Type :

Through Hole

On Chip Program ROM Width :

16

Factory Lead Time :

7 Weeks

Published :

2012