PIC12F1822T-E/MF
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- Mfr.Part #
- PIC12F1822T-E/MF
- Manufacturer
- Microchip Technology
- Package / Case
- 8-VDFN Exposed Pad
- Datasheet
- Download
- Description
- IC MCU 8BIT 3.5KB FLASH 8DFN
- Stock
- 40,931
- In Stock ：
- 40,931
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- Manufacturer :
- Microchip Technology
- Product Category :
- Microcontrollers
- Supplier Device Package :
- 8-DFN (3x3)
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Terminations :
- 8
- Number of I/O :
- 6
- Series :
- PIC® XLP™ 12F
- RAM Size :
- 128 x 8
- Qualification Status :
- Not Qualified
- Number of ADC Channels :
- 4
- Product Status :
- Active
- Program Memory Size :
- 3.5KB 2K x 14
- JESD-30 Code :
- R-PDSO-N8
- Speed :
- 32MHz
- Tradename :
- PIC
- Terminal Finish :
- Matte Tin (Sn) - annealed
- uPs/uCs/Peripheral ICs Type :
- MICROCONTROLLER, RISC
- Operating Temperature :
- -40°C~125°C TA
- Product Category :
- 8-bit Microcontrollers - MCU
- Maximum Operating Temperature :
- + 125 C
- Published :
- 2010
- Number of I/Os :
- 6 I/O
- Program Memory Type :
- Flash
- JESD-609 Code :
- e3
- Power Supplies :
- 2/5V
- Number of Timers/Counters :
- 3
- Peripherals :
- Brown-out Detect/Reset, POR, PWM, WDT
- Minimum Operating Temperature :
- - 40 C
- EEPROM Size :
- 256 x 8
- Data Converters :
- A/D 4x10b; D/A 1x5b
- Data Converter :
- A/D 4x10b; D/A 1x5b
- Terminal Form :
- NO LEAD
- Voltage - Supply (Vcc/Vdd) :
- 1.8V~5.5V
- Mounting Style :
- SMD/SMT
- Factory Lead Time :
- 8 Weeks
- Connectivity :
- I2C, LINbus, SPI, UART/USART
- Product Type :
- 8-bit Microcontrollers - MCU
- Base Product Number :
- PIC12F1822
- Lead Free :
- Lead Free
- Package / Case :
- 8-VDFN Exposed Pad
- Oscillator Type :
- Internal
- Watchdog Timer :
- yes
- Base Part Number :
- PIC12F1822
- Data Bus Width :
- 8B
- Packaging :
- Tape and Reel (TR)
- Max Power Dissipation :
- 800mW
- Interface :
- I2C, LIN, SPI, UART, USART
- Manufacturer :
- Microchip
- RoHS Status :
- ROHS3 Compliant
- Core Processor :
- PIC
- RoHS :
- Details
- Bit Size :
- 8
- Interfaces :
- I2C/SPI/USART
- Terminal Position :
- Dual
- Interface Type :
- EUSART, I2C, SPI
- Surface Mount :
- yes
- Brand :
- Microchip Technology
- Device Core :
- PIC
- Package :
- Tape and Reel (TR)
- Memory Size :
- 3.5kB
- Core Size :
- 8-Bit
- Mounting Type :
- Surface Mount
- Peak Reflow Temperature (Cel) :
- 260
- CPU Family :
- PIC
- Frequency :
- 32MHz
- Datasheets
- PIC12F1822T-E/MF
PIC12F1822T-E/MF Documents
Microcontrollers Microchip Technology PIC12F1822T-E/MF Overview
The Microcontrollers Microchip Technology PIC12F1822T-E/MF is a cutting-edge, 8-bit MCU from Microchip Technology, designed to offer advanced features in a compact form. This microcontroller is equipped with 3.5KB of flash memory and operates efficiently within the 8DFN package, making it a superb choice for sophisticated applications where space and power efficiency are critical. With its high level of integration and scalability, the PIC12F1822T-E/MF is optimized for a variety of applications, from consumer electronics to industrial automation systems, providing a reliable and flexible solution for embedded control systems.
PIC12F1822T-E/MF Features
- 8-bit processor core for efficient data handling.
- 3.5KB flash memory for program storage.
- Low-power consumption suitable for battery-operated devices.
- Compact 8DFN package allows for minimal footprint on PCB designs.
- Broad voltage range for versatile application across different power environments.
PIC12F1822T-E/MF Applications
- Consumer Electronics: Ideal for integration in small home appliances and entertainment systems where space is at a premium and efficiency is desired.
- Automotive Applications: Used in car entertainment systems and onboard diagnostics to enhance functionality and reliability.
- Industrial Automation: Powers sensors and actuators, facilitating sophisticated control mechanisms in automated environments.
- Medical Devices: Deployed in portable medical instrumentation where precision and reliability are critical for patient care.
- Wearable Technology: Supports the development of smart wearable devices requiring compact size and efficient power management.
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