MXSMBJ6.5AE3

Manufacturer :

Microchip Technology

Product Category :

Terminal Form :

C BEND

Package / Case :

DO-214AA, SMB

Test Current :

10mA

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Mounting Type :

Surface Mount

Power Line Protection :

No

Element Configuration :

Single

Voltage - Breakdown (Min) :

7.22V

ECCN Code :

EAR99

Peak Reflow Temperature (Cel) :

260

Reverse Standoff Voltage :

6.5V

Applications :

GENERAL PURPOSE

JESD-609 Code :

e3

Lifecycle Status :

IN PRODUCTION (Last Updated: 3 weeks ago)

Mount :

Surface Mount

Direction :

Unidirectional

Number of Elements :

1

Max Reverse Leakage Current :

500μA

Diode Element Material :

SILICON

Pin Count :

2

Number of Terminations :

2

Pbfree Code :

yes

Power - Peak Pulse :

600W

Terminal Finish :

Matte Tin (Sn) - annealed

Clamping Voltage :

11.2V

Series :

Military, MIL-PRF-19500

Peak Pulse Power :

600W

Packaging :

Bulk

Time@Peak Reflow Temperature-Max (s) :

40

Terminal Position :

Dual

Number of Pins :

2

Operating Temperature :

-65°C~150°C TJ

Peak Pulse Current :

53.6A

RoHS Status :

Non-RoHS Compliant

Type :

Zener

Breakdown Voltage :

7.6V

Unidirectional Channels :

1