MXSMBG30AE3

Manufacturer :

Microchip Technology

Product Category :

Peak Pulse Power :

600W

Max Reverse Leakage Current :

1μA

Operating Temperature :

-65°C~150°C TJ

Voltage - Breakdown (Min) :

33.3V

Packaging :

Bulk

Test Current :

1mA

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

JESD-609 Code :

e3

ECCN Code :

EAR99

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Number of Terminations :

2

Pin Count :

2

Mount :

Surface Mount

Peak Pulse Current :

12.4A

Number of Pins :

2

Pbfree Code :

yes

Number of Elements :

1

Reverse Standoff Voltage :

30V

Power Line Protection :

No

Type :

Zener

Mounting Type :

Surface Mount

Clamping Voltage :

48.4V

Package / Case :

DO-215AA, SMB Gull Wing

Terminal Finish :

Matte Tin (Sn) - annealed

Peak Reflow Temperature (Cel) :

260

Power - Peak Pulse :

600W

Diode Element Material :

SILICON

Series :

Military, MIL-PRF-19500

Element Configuration :

Single

Applications :

GENERAL PURPOSE

Breakdown Voltage :

35.05V

Unidirectional Channels :

1

Direction :

Unidirectional

RoHS Status :

Non-RoHS Compliant

Terminal Position :

Dual

Time@Peak Reflow Temperature-Max (s) :

40