MXSMBG130CAE3

Manufacturer :

Microchip Technology

Product Category :

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Terminal Position :

Dual

Published :

1997

Mounting Type :

Surface Mount

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Voltage - Breakdown (Min) :

144V

Element Configuration :

Single

Peak Reflow Temperature (Cel) :

260

RoHS Status :

Non-RoHS Compliant

Max Reverse Leakage Current :

1μA

Reverse Standoff Voltage :

130V

Time@Peak Reflow Temperature-Max (s) :

40

Number of Pins :

2

Factory Lead Time :

18 Weeks

Series :

Military, MIL-PRF-19500

Operating Temperature :

-65°C~150°C TJ

Test Current :

1mA

Mount :

Surface Mount

Pin Count :

2

JESD-609 Code :

e3

Packaging :

Bulk

Direction :

Bidirectional

Diode Element Material :

SILICON

Number of Terminations :

2

Peak Pulse Power :

600W

ECCN Code :

EAR99

Breakdown Voltage :

151.5V

Peak Pulse Current :

2.9A

Terminal Finish :

Matte Tin (Sn) - annealed

Type :

Zener

Clamping Voltage :

209V

Power - Peak Pulse :

600W

Package / Case :

DO-215AA, SMB Gull Wing

Number of Elements :

1

Applications :

GENERAL PURPOSE

Pbfree Code :

yes

Power Line Protection :

No

Bidirectional Channels :

1