MT53D384M32D2DS-053 WT ES:E

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Mfr.Part #
MT53D384M32D2DS-053 WT ES:E
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 12GBIT 1866MHZ 200WFBGA
Stock
35,195
In Stock :
35,195

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Manufacturer :
Micron Technology
Product Category :
Memory
Packaging :
Tray
Package / Case :
200-WFBGA
Mounting Type :
Surface Mount
Operating Temperature :
-30°C~85°C TC
Voltage - Supply :
1.1V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Format :
DRAM
Clock Frequency :
1866MHz
Memory Type :
Volatile
Memory Size :
12Gb 384M x 32
RoHS Status :
ROHS3 Compliant
Introducing Memory Micron Technology MT53D384M32D2DS-053 WT ES:E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:200-WFBGA, Mounting Type:Surface Mount, Operating Temperature:-30°C~85°C TC, MT53D384M32D2DS-053 WT ES:E pinout, MT53D384M32D2DS-053 WT ES:E datasheet PDF, MT53D384M32D2DS-053 WT ES:E amp .Beyond Memory Micron Technology MT53D384M32D2DS-053 WT ES:E ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53D384M32D2DS-053 WT ES:E


Memory + Micron Technology + MT53D384M32D2DS-053 WT ES:E Overview

Micron Technology's MT53D384M32D2DS-053 WT ES:E is a high-performance DRAM integrated circuit designed for demanding applications. With a capacity of 12 Gbit and a clock speed of 1866 MHz, this memory solution offers fast and reliable data storage and retrieval. It comes in a compact 200WFBGA package, making it ideal for devices where space is limited, while its advanced architecture ensures optimal power efficiency. This Memory + Micron Technology + MT53D384M32D2DS-053 WT ES:E is perfect for a variety of enterprise applications and consumer electronics, providing both speed and scalability for B2B clients seeking bulk solutions for their hardware requirements.

MT53D384M32D2DS-053 WT ES:E Features

  • High Capacity: Offers 12 Gbit of storage for large-scale data handling.
  • High Speed: 1866 MHz clock speed for fast data processing and retrieval.
  • Compact Design: 200WFBGA package for space-saving integration into various devices.
  • Energy Efficient: Designed to minimize power consumption, ensuring longer device battery life and reduced operational costs.

MT53D384M32D2DS-053 WT ES:E Applications

  • Mobile Devices: Ideal for smartphones and tablets where high-speed memory is crucial for performance.
  • Servers and Data Centers: The high capacity and speed make it suitable for data-intensive applications in enterprise settings.
  • Embedded Systems: Its compact size and efficiency make it a great choice for embedded applications in IoT and automotive electronics.
  • Gaming Consoles: Provides the high-speed memory required for smooth gaming experiences and quick loading times.
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Shipping Cost

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